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Interconnection system on a plane adjacent to a solid-state device structure

  • US 8,115,265 B2
  • Filed: 03/26/2009
  • Issued: 02/14/2012
  • Est. Priority Date: 03/26/2008
  • Status: Expired due to Fees
First Claim
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1. An interconnection system for a MEMS device, comprising:

  • a MEMS device with contact points, including,a silicon substrate with a face surface that has a pattern of recesses which define functional elements of the MEMS device leaving sharp-edged, highly doped ridges; and

    a cover with a mating surface coupled to the face surface, the cover including patterns of metal films that engage the ridges to form connections from the face surface to the patterns of metal film on the mating surface,wherein the MEMS device is an accelerometer and includes one or more seismic masses configured to pivot around pivot axes defined by pivot points between the seismic masses and a body of the silicon substrate.

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