Microelectronic assemblies having compliancy and methods therefor
First Claim
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1. A microelectronic assembly comprising:
- a semiconductor wafer having a first surface and contacts accessible at the first surface;
compliant bumps of dielectric material overlying the first surface of said semiconductor wafer, each said compliant bump having a planar top surface;
a dielectric layer overlying the first surface of said semiconductor wafer and at least edges of said compliant bumps, wherein the planar top surfaces of said compliant bumps and said contacts are accessible through said dielectric layer;
conductive traces electrically connected with said contacts and extending therefrom to overlie the planar top surfaces of said compliant bumps; and
conductive elements overlying the planar top surfaces in contact with said conductive traces.
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Abstract
A microelectronic assembly is disclosed that includes a semiconductor wafer with contacts, compliant bumps of dielectric material overlying the first surface of the semiconductor wafer, and a dielectric layer overlying the first surface of the semiconductor wafer and edges of the compliant bumps. The compliant bumps have planar top surfaces which are accessible through the dielectric layer. Conductive traces may be electrically connected with contacts and extend therefrom to overlie the planar top surfaces of the compliant bumps. Conductive elements may overlie the planar top surfaces in contact with the conductive traces.
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Citations
19 Claims
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1. A microelectronic assembly comprising:
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a semiconductor wafer having a first surface and contacts accessible at the first surface; compliant bumps of dielectric material overlying the first surface of said semiconductor wafer, each said compliant bump having a planar top surface; a dielectric layer overlying the first surface of said semiconductor wafer and at least edges of said compliant bumps, wherein the planar top surfaces of said compliant bumps and said contacts are accessible through said dielectric layer; conductive traces electrically connected with said contacts and extending therefrom to overlie the planar top surfaces of said compliant bumps; and conductive elements overlying the planar top surfaces in contact with said conductive traces. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification