Lighting device

• US 8,115,369 B2
• Filed: 11/08/2010
• Issued: 02/14/2012
• Est. Priority Date: 11/09/2009
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Kang, Seok Jin, Choi, Tae Young, Hong, Sungho, Kim, Dong Soo
• Primary Examiner(s): Patel, Nimeshkumar
• Assistant Examiner(s): RALEIGH, DONALD L
• Application Number:
  US12/941,523
• Publication Number:
  US 20110109216A1
• Time in Patent Office: 463 Days
• Field of Search: 257/40, 257/72, 257 98-100, 257642-643, 257/759, 313498-512, 315/169.1, 315/169.3, 427/58, 427/64, 427/66, 427532-535, 427/539, 428690-691, 428/917, 438 26- 29, 438/34, 438/82, 438/455, 445 24- 25
• US Class Current: 313/45
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21K 9/238 Arrangement or mounting of circuit elements integrated in the light source
• CPC Class Codes: F21S 2/005 of modular construction
• CPC Class Codes: F21V 23/006 the substrate being distinct from the light source holder
• CPC Class Codes: F21V 29/713 in direct thermal and mechanical contact of each other to form a single system
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

Disclosed is a lighting device. The lighting device includes:

• • a substrate;
  • a light emitting device disposed on the substrate;
  • a heat radiating body radiating heat from the light emitting device; and
  • a pad being interposed between the substrate and the heat radiating body and transferring heat generated from the light emitting device to the heat radiating body and comprising silicon of 10 to 30 wt %, a filler of 70 to 90 wt %, glass fiber of 2 to 7 wt % in terms of weight percent (wt %).

Claims

1. A lighting device comprising:

a substrate;

a light emitting device disposed on the substrate;

a heat sink to radiate heat from the light emitting device; and

a pad being interposed between the substrate and the heat sink and transferring heat generated from the light emitting device to the heat sink and comprising silicon of 10 to 30 wt °

A, a filler of 70 to 90 wt %, glass fiber of 2 to 7 wt % in terms of weight percent (wt %), wherein the light emitting device includes an LED.

2. The lighting device of claim 1, wherein the pad further comprises platinum compound as a catalyst.

3. The lighting device of claim 1, wherein the filler comprises aluminum oxide.

4. The lighting device of claim 1, wherein the pad comprises:

a silicon mixed layer comprising the silicon and the filler; and

a fiber layer comprising the glass fiber.

5. The lighting device of claim 4, wherein the fiber layer is comprised within the silicon mixed layer.

6. The lighting device of claim 5, wherein an adhesive agent is disposed on one side of the silicon mixed layer.

7. The lighting device of claim 1, wherein the thickness of the pad is from 0.4 T to 0.7 T in case of the lighting device having a power consumption of 3.5 watts to 8 watts.

8. The lighting device of claim 1, wherein the thickness of the pad is from 0.7 T to 1.0 T in case of the lighting device having a power consumption of 15 watts.

9. The lighting device of claim 1, wherein the area of thermal pad is larger than that of the substrate.

10. The lighting device of claim 1, wherein one side of the heat sink receives the substrate and the pad.

11. The lighting device of claim 1, further comprising

an outer case being spaced apart from an outer surface of the heat sink and surrounding the heat sink.

12. The lighting device of claim 11, wherein an outer surface of the heat sink comprises at least one heat radiating fin extending from the outer surface.

13. The lighting device of claim 1, further comprising

a guide member surrounding a lower end of the heat sink such that the substrate is fixed to the heat sink, wherein the surface of the guide member comprises a hole for allowing external air to flow into the lighting device.

14. The lighting device of claim 1, wherein the light emitting device comprises a plurality of light emitting devices disposed in substantially a radial arrangement based on a central axis of the substrate, and wherein the pad is interposed between the substrate and the heat sink in correspondence with an area of the substrate, on which the plurality of the light emitting devices is disposed.

15. The lighting device of claim 14, wherein a part of the pad is open.

16. A lighting device comprising:

a substrate;

a light emitting device disposed on the substrate;

a heat sink to radiate radiating heat from the light emitting device; and

a pad being interposed between the substrate and the heat sink and comprising a plurality of layers and comprising silicon of 10 to 30 wt % and a filler of 70 to 90 wt % in terms of weight percent (wt %), wherein the light emitting device includes an LED.

17. The lighting device of claim 16, wherein the pad comprises a mixed layer comprising silicon and comprises a fiber layer comprising glass fiber.

18. The lighting device of claim 17, wherein the mixed layer further comprises a filler comprising aluminum oxide.

19. A lighting device comprising:

a light emitting module substrate comprising a plurality of light emitting devices;

a pad being disposed on one side of the light emitting module substrate and comprising a plurality of layers and comprising a glass fiber and a filler of 70 to 90 weight (wt) % in terms of weight percent (wt %);

a heat sink comprising a receiving groove for receiving the pad and the light emitting module substrate so that one side of the heat sink contacts with the pad;

an outer case being spaced apart at a predetermined interval from the outer surface of the heat sink and surrounding the heat sink, wherein each of the light emitting devices includes an LED.

20. The lighting device of claim 19, wherein the pad transfers heat generated from a plurality of the light emitting device to the heat sink.