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Method and system for packaging a MEMS device

  • US 8,115,983 B2
  • Filed: 04/14/2009
  • Issued: 02/14/2012
  • Est. Priority Date: 09/27/2004
  • Status: Expired due to Fees
First Claim
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1. A display device, comprising:

  • an array of interferometric modulators disposed on a first surface of a transparent substrate;

    a carrier comprising a first surface and a second surface, wherein a first surface of the carrier is sealed to said transparent substrate to form a package encapsulating the interferometric modulator array; and

    an outer device shell, wherein the carrier is disposed within the outer device shell, wherein a rear portion of the outer device shell is disposed on the opposite side of the carrier from the transparent substrate, wherein the rear portion of the outer device shell extends beyond the edges of the second surface of the carrier, and wherein the rigidity of the carrier is greater than the rigidity of the outer device shell.

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