Process for forming an isolated electrically conductive contact through a metal package

• US 8,117,744 B2
• Filed: 02/14/2011
• Issued: 02/21/2012
• Est. Priority Date: 05/25/2007
• Status: Expired due to Fees

• Current Assignee: Electro Scientific Industries Incorporated (MKS Instruments Incorporated)
• Original Assignee: Electro Scientific Industries Incorporated (MKS Instruments Incorporated)
• Inventors: Nashner, Michael, Howerton, Jeffrey
• Primary Examiner(s): Banks, Derris
• Assistant Examiner(s): PARVEZ, AZM A
• Application Number:
  US13/027,167
• Publication Number:
  US 20110131807A1
• Time in Patent Office: 372 Days
• Field of Search: 298/52, 438/8, 438/689, 438/696, 438/694, 257/E23.011, 257/E21.577
• US Class Current: 29/852
• CPC Class Codes: H05K 1/053 the metal substrate being covered by an inorganic insulating layer
• CPC Class Codes: H05K 2201/0179 Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
• CPC Class Codes: H05K 2201/09581 Applying an insulating coating on the walls of holes
• CPC Class Codes: H05K 2201/09827 Tapered, e.g. tapered hole, via or groove
• CPC Class Codes: H05K 2203/0315 Oxidising metal
• CPC Class Codes: H05K 2203/0323 Working metal substrate or core, e.g. by etching, deforming
• CPC Class Codes: H05K 2203/107 Using laser light
• CPC Class Codes: H05K 3/4061 for via connections in inorganic insulating substrates
• CPC Class Codes: H05K 3/445 having insulated holes or insulated via connections through the metal core
• CPC Class Codes: H05K 5/0247 Electrical details of casings, e.g. terminals, passages for cables or wiring
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

A method of forming an isolated electrically conductive contact through a metallic substrate includes creating at least one via through the substrate, where the via includes a first opening in a top surface of the substrate, a second opening in an opposing bottom surface and at least one continuous sidewall extending therebetween. A dielectric sleeve is formed on the at least one sidewall of the via while preserving at least a portion of the through via. An electrically conductive filler is then placed into the via. In the examples disclosed, the filler may be a conductive ink or a conductive epoxy.

Claims

1. A method of creating an electrically isolated contact comprising:

forming a through via in a metallic substrate wherein the through via includes a first opening in a top surface of the metallic substrate, a second opening in an opposing bottom surface of the metallic substrate and at least one continuous sidewall extending between the first opening and the second opening;

forming a dielectric sleeve on the at least one sidewall of the via while preserving at least a portion of the through via; and

substantially filling the through via between the top surface and the bottom surface with an electrically conductive material in a single filling step, wherein the electrically conductive material is a conductive ink.

2. The method in claim 1 wherein substantially filling the through via comprises completely filling the through via.

6. The method of claim 1 wherein the first opening has a diameter between 90 to 200 micrometers and the second opening has a diameter between 20 to 50 micrometers.

3. A method of creating an electrically isolated contact comprising:

forming a conically shaped through via in a metallic substrate wherein the through via includes a first opening in a top surface of the metallic substrate, a second opening in an opposing bottom surface of the metallic substrate and at least one continuous sidewall extending between the first opening and the second opening;

forming a dielectric sleeve on the at least one sidewall of the through via while preserving at least a portion of the through via; and

completely filling the through via between the top surface and the bottom surface with one electrically conductive material.

4. The method as in claim 3 wherein the first opening has a diameter between 90 to 200 micrometers and the second opening has a diameter between 20 to 50 micrometers.

5. The method of claim 3 wherein the electrically conductive material is a conductive ink.