×

Process for forming an isolated electrically conductive contact through a metal package

  • US 8,117,744 B2
  • Filed: 02/14/2011
  • Issued: 02/21/2012
  • Est. Priority Date: 05/25/2007
  • Status: Expired due to Fees
First Claim
Patent Images

1. A method of creating an electrically isolated contact comprising:

  • forming a through via in a metallic substrate wherein the through via includes a first opening in a top surface of the metallic substrate, a second opening in an opposing bottom surface of the metallic substrate and at least one continuous sidewall extending between the first opening and the second opening;

    forming a dielectric sleeve on the at least one sidewall of the via while preserving at least a portion of the through via; and

    substantially filling the through via between the top surface and the bottom surface with an electrically conductive material in a single filling step, wherein the electrically conductive material is a conductive ink.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×