Implantable capacitive pressure sensor system and method
First Claim
1. An implantable capacitive pressure sensor capsule comprising:
- a substrate;
an interlayer coupled to a first surface of the substrate, wherein the interlayer is formed of ceramic;
a conductive plate embedded within the substrate;
a conductive diaphragm hermetically bonded to the interlayer;
a lid hermetically sealed against a second surface of the substrate opposite the first surface; and
pressure sensing circuitry disposed within a volume generally defined by the lid and the second surface of the substrate, wherein the pressure sensing circuitry is electrically coupled to the conductive plate.
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Abstract
Embodiments of the invention provide systems and methods for an implantable capacitive pressure sensor. Some embodiments of the invention include a capacitive pressure sensor capsule comprising a substrate, a conductive plate functionally coupled to the substrate, a conductive diaphragm spaced from the conductive plate and functionally coupled to the substrate, a lid hermetically sealed against the substrate, and pressure sensing circuitry disposed within a volume generally defined by the lid and the substrate. Embodiments of the invention also include a lead provided with an implantable pressure sensor capsule and a method of manufacturing a capacitive pressure sensor capsule.
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Citations
12 Claims
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1. An implantable capacitive pressure sensor capsule comprising:
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a substrate; an interlayer coupled to a first surface of the substrate, wherein the interlayer is formed of ceramic; a conductive plate embedded within the substrate; a conductive diaphragm hermetically bonded to the interlayer; a lid hermetically sealed against a second surface of the substrate opposite the first surface; and pressure sensing circuitry disposed within a volume generally defined by the lid and the second surface of the substrate, wherein the pressure sensing circuitry is electrically coupled to the conductive plate. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A lead provided with an implantable pressure sensor capsule comprising:
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an elongated lead body having a window; and an implantable pressure sensor capsule integrated in the lead body, the pressure sensor capsule including; a substrate; an interlayer coupled to a first surface of the substrate, wherein the interlayer is formed of ceramic; a conductive plate embedded within the substrate; a conductive diaphragm hermetically bonded to the interlayer; a lid hermetically sealed against a second surface of the substrate opposite the first surface; and pressure sensing circuitry disposed within a volume generally defined by the lid and the second surface of the substrate, wherein the pressure sensing circuitry is electrically coupled to the conductive plate, and further wherein at least a portion of the conductive diaphragm is located in the window of the lead body where it is directly exposed to bodily fluids when the lead body is implanted in a body. - View Dependent Claims (9, 10, 11, 12)
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Specification