Cleaning process residues from substrate processing chamber components
First Claim
Patent Images
1. A method of cleaning a component of a substrate processing chamber, the component having both internal and external surfaces, and the method comprising:
- (a) removing the component from the substrate processing chamber, the component having process residues on both the internal and external surfaces of the component;
(b) placing the component in a cleaning chamber having an exhaust port located under the component;
(c) exposing the component to an energized fluorinated cleaning gas comprising oxygen and a fluorinated gas; and
(d) exhausting the energized fluorinated cleaning gas from under the component so that the energized fluorinated cleaning gas is sucked past the internal surfaces of the component to clean process residues on both the internal and external surfaces of the component.
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Abstract
A component from a substrate processing chamber which has plasma process residues on both its internal and external surfaces, is removed from the processing chamber, and transferred to a cleaning chamber. The component is exposed to an energized cleaning gas in the cleaning chamber, and the cleaning gas is exhausted from below the component so that the cleaning gas cleans off the residues on both the internal and external surfaces of the component. It has been determined that the cleaning gas can also repair surface defects in the component.
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Citations
24 Claims
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1. A method of cleaning a component of a substrate processing chamber, the component having both internal and external surfaces, and the method comprising:
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(a) removing the component from the substrate processing chamber, the component having process residues on both the internal and external surfaces of the component; (b) placing the component in a cleaning chamber having an exhaust port located under the component; (c) exposing the component to an energized fluorinated cleaning gas comprising oxygen and a fluorinated gas; and (d) exhausting the energized fluorinated cleaning gas from under the component so that the energized fluorinated cleaning gas is sucked past the internal surfaces of the component to clean process residues on both the internal and external surfaces of the component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 16, 17, 18, 21)
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12. A method of simultaneously cleaning and repairing surface defects of a component from a substrate processing chamber, the method comprising:
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(a) removing a component from the substrate processing chamber, the component having process residues and surface defects on both internal and external surfaces of the component; (b) cleaning the process residues off the component and repairing surface defects of the component in a cleaning chamber which is a different chamber than the substrate processing chamber, by; (i) placing the component in the cleaning chamber over an exhaust port of the cleaning chamber; (ii) exposing the component in the cleaning chamber to an energized cleaning gas comprising oxygen and a fluorinated gas; and (iii) exhausting the cleaning gas from the exhaust port under the component, so that the cleaning gas is sucked past the internal surfaces of the component to clean process residues on both the internal and external surfaces of the component while repairing the surface defects of the component. - View Dependent Claims (13, 14, 15, 19, 20, 22)
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23. A method of cleaning a component of a substrate processing chamber, the component comprising a plurality of holes having process residues therein, the method comprising:
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(a) removing the component from the substrate processing chamber; (b) placing the component in a cleaning chamber having an exhaust port such that the exhaust port is under the component; (c) energizing a fluorinated cleaning gas comprising oxygen and a fluorinated gas in the cleaning chamber; and (d) exhausting the fluorinated cleaning gas from under the component so that the cleaning gas flows through the holes having the process residues therein to clean the process residues from the holes. - View Dependent Claims (24)
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Specification