Semiconductor device and method of forming the same
First Claim
1. A semiconductor device, comprising:
- an inactive region configured to define first and second active regions in a semiconductor substrate;
a first upper interconnection disposed on the inactive region adjacent to the first active region;
a first contact plug configured to have a top surface at a same level as a top surface of the first upper interconnection and contact the first active region and the first upper interconnection;
a second lower interconnection configured to have a top surface disposed at the same level as the top surface of the first contact plug and disposed on the second active region;
a second upper interconnection disposed on the second lower interconnection; and
a second contact plug configured to contact the second upper interconnection and the second active region.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor device, and a method of forming the same, includes forming a cell bit line pattern and a peripheral gate pattern on a semiconductor substrate. The cell bit line pattern may be formed on an inactive region adjacent to a cell active region of the semiconductor substrate. The peripheral gate pattern may be disposed on a peripheral active region of the semiconductor substrate. A cell contact plug may be formed between the cell bit line pattern and the cell active region. A peripheral contact plug may be formed on the peripheral active region on a side of the peripheral gate pattern. An insulating layer may be formed to expose top surfaces of the cell bit line pattern, the peripheral gate pattern, and the cell and peripheral contact plugs at substantially the same level.
-
Citations
16 Claims
-
1. A semiconductor device, comprising:
-
an inactive region configured to define first and second active regions in a semiconductor substrate; a first upper interconnection disposed on the inactive region adjacent to the first active region; a first contact plug configured to have a top surface at a same level as a top surface of the first upper interconnection and contact the first active region and the first upper interconnection; a second lower interconnection configured to have a top surface disposed at the same level as the top surface of the first contact plug and disposed on the second active region; a second upper interconnection disposed on the second lower interconnection; and a second contact plug configured to contact the second upper interconnection and the second active region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. A semiconductor device, comprising:
-
inactive regions disposed in a cell array region and a peripheral circuit region of a semiconductor substrate; cell and peripheral active regions defined by the inactive regions in the cell array region and the peripheral circuit region; a first interconnection, a second interconnection, and a cell contact plug disposed in the cell array region, wherein the first interconnection is disposed on the cell active region and the inactive region disposed adjacent to the cell active region, the second interconnection is disposed on the inactive region adjacent to the cell active region and configured to intersect the first interconnection, and the cell contact plug is configured to have a top surface at substantially a same level as a top surface of the second interconnection and contacts the cell active region and the second interconnection; and a third interconnection, a fourth interconnection, and a peripheral contact plug disposed in the peripheral circuit region, wherein the third interconnection is disposed on the peripheral active region, formed of the same material as the second interconnection, and configured to have a top surface at the same level as the top surface of the cell contact plug, the fourth interconnection is disposed on the third interconnection, and the peripheral contact plug is configured to contact the peripheral active region and the fourth interconnection, wherein the first interconnection is partially inserted into the second interconnection across the second interconnection or contacts the second interconnection under the second interconnection across the second interconnection. - View Dependent Claims (12, 13, 14, 15, 16)
-
Specification