Organic light emitting display and method of fabricating the same
First Claim
1. An organic light emitting display (OLED) device comprising:
- a first substrate comprising a pixel region and a non-pixel region;
an array of organic light emitting pixels formed over the pixel region;
a conductive line formed over a surface of the non-pixel region, wherein the conductive line is substantially flat throughout the surface;
a second substrate placed over the first substrate such that the array and the conductive line are interposed between the first and second substrates;
a planarization layer formed over at least part of the non-pixel region of the first substrate, wherein the planarization layer comprises an opening; and
a frit seal interposed between the first and second substrates and surrounding the array, the frit seal interconnecting the first and second substrates, the frit seal comprising a portion contacting the conductive line through the opening in the planarization layer and overlapping the conductive line in a segment of the device where the frit seal is formed, wherein the portion of the frit seal substantially eclipses the conductive line in the segment when viewed from the second substrate, wherein the frit seal contacts the planarization layer, and wherein the planarization layer covers a portion of the conductive line.
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Abstract
Provided are an organic light emitting display and a method of fabricating the same that are capable of preventing an element from being damaged due to a large amount of heat generated when the laser irradiates a glass frit for sealing a substrate. The organic light emitting display includes: a first substrate comprising a pixel region and a non-pixel region; an array of organic light emitting pixels formed over the pixel region; a conductive line formed over the non-pixel region; a second substrate placed over the first substrate such that the array and the conductive line are interposed between the first and second substrates; and a frit seal interposed between the first and second substrates and surrounding the array, the frit seal interconnecting the first and second substrates, the frit seal comprising a portion overlapping the conductive line, wherein when viewed from the second substrate, the portion of the flit seal substantially eclipses the conductive line.
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Citations
20 Claims
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1. An organic light emitting display (OLED) device comprising:
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a first substrate comprising a pixel region and a non-pixel region; an array of organic light emitting pixels formed over the pixel region; a conductive line formed over a surface of the non-pixel region, wherein the conductive line is substantially flat throughout the surface; a second substrate placed over the first substrate such that the array and the conductive line are interposed between the first and second substrates; a planarization layer formed over at least part of the non-pixel region of the first substrate, wherein the planarization layer comprises an opening; and a frit seal interposed between the first and second substrates and surrounding the array, the frit seal interconnecting the first and second substrates, the frit seal comprising a portion contacting the conductive line through the opening in the planarization layer and overlapping the conductive line in a segment of the device where the frit seal is formed, wherein the portion of the frit seal substantially eclipses the conductive line in the segment when viewed from the second substrate, wherein the frit seal contacts the planarization layer, and wherein the planarization layer covers a portion of the conductive line. - View Dependent Claims (2, 3, 4, 5, 6, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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7. An organic light emitting display (OLED) device comprising:
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a first substrate comprising a pixel region and a non-pixel region; an array of organic light emitting pixels formed over the pixel region; a conductive line formed over a surface of the non-pixel region, wherein the conductive line is substantially flat throughout the surface; a second substrate placed over the first substrate such that the array and the conductive line are interposed between the first and second substrates; and a planarization layer formed over at least part of the non-pixel region of the first substrate, wherein the planarization layer comprises an opening; and a frit seal interposed between the first and second substrates and surrounding the array, the frit seal interconnecting the first and second substrates, the frit seal comprising a portion contacting the conductive line through the opening in the planarization layer and overlapping the conductive line in a segment of the device where the frit seal is formed, wherein the portion of the frit seal substantially eclipses the conductive line in the segment when viewed from the second substrate; wherein the fit seal further comprises a non-eclipsing portion in another segment of the device, wherein the non-eclipsing portion of the frit seal does not eclipse the conductive line when viewed from the second substrate, wherein the conductive line comprises a non-eclipsed portion and an eclipsed portion in a cross-section of the conductive line taken along a line where the cross-sectional area of the conductive line is the smallest, and wherein the non-eclipsed portion is substantially smaller than the eclipsed portion.
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Specification