Optical electrical system in package for LED based lighting system
First Claim
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1. A packaged electronic device comprising:
- a package configured and arranged to be individually positioned and coupled to peripheral electronic devices;
a light emitting semiconductor device deposed on the package, anda switch, deposed on the package, for controlling the light emitting semiconductor device; and
a plurality of light emitting diodes and a plurality of switches, wherein each switch is disposed on a separate semiconductor substrate being electrically decoupled from a semiconductor substrate of another switch to allow large voltage differences between the switches without damaging the semiconductor device.
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Abstract
Packaged semiconductor electronic device to be individually positioned and coupled to peripheral electronic devices, the package comprising a light emitting semiconductor device, and a switch for controlling the light emitting semiconductor device.
16 Citations
11 Claims
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1. A packaged electronic device comprising:
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a package configured and arranged to be individually positioned and coupled to peripheral electronic devices; a light emitting semiconductor device deposed on the package, and a switch, deposed on the package, for controlling the light emitting semiconductor device; and a plurality of light emitting diodes and a plurality of switches, wherein each switch is disposed on a separate semiconductor substrate being electrically decoupled from a semiconductor substrate of another switch to allow large voltage differences between the switches without damaging the semiconductor device. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An electronic device comprising:
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a plurality of light emitting semiconductor devices, switches for each of the light emitting semiconductor devices, wherein each-switch and light emitting semiconductor device pair are electrically decoupled from another switch and light emitting semiconductor device pair to allow large voltage differences between the switches without damaging the electronic device. - View Dependent Claims (8, 9, 10)
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11. A method of manufacturing a packaged electronic device, comprising the steps of:
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providing a carrier comprising a plurality of pads; assembling a switch and a light emitting semiconductor device to the at least one pad of the carrier and electrically coupling the switch and the light emitting semiconductor devices to contact pads; providing an encapsulation; patterning the carrier so as to mutually electrically isolate individual pads.
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Specification