Fault detection apparatuses and methods for fault detection of semiconductor processing tools

• US 8,120,376 B2
• Filed: 12/12/2007
• Issued: 02/21/2012
• Est. Priority Date: 12/12/2007
• Status: Active Grant

• Current Assignee: Novellus Systems Incorporated (Lam Research Corporation)
• Original Assignee: Novellus Systems Incorporated (Lam Research Corporation)
• Inventors: Hansen, Keith John
• Primary Examiner(s): NGUYEN, HOAI AN D
• Application Number:
  US11/955,148
• Publication Number:
  US 20090153144A1
• Time in Patent Office: 1,532 Days
• Field of Search: 324/511, 324/500, 324/555, 324/765, 324/763, 324/762.01
• US Class Current: 324/762.01
• CPC Class Codes: G01R 31/00 Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere measuring superconductive properties G01R33/1238; testing or measuring semiconductors or solid state devices during manufacture H01L22/00; testing line transmission systems H04B3/46
• CPC Class Codes: G05B 2219/31356 Automatic fault detection and isolation
• CPC Class Codes: G05B 2219/37224 Inspect wafer
• CPC Class Codes: G05B 23/0229 knowledge based, e.g. expert systems; genetic algorithms
• CPC Class Codes: H01L 21/67288 Monitoring of warpage, curvature, damage, defects or the like
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 22/14 for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

Fault detection apparatuses and methods for detecting a processing or hardware performance fault of a semiconductor production tool have been provided. In an exemplary embodiment, a method for detecting a fault of a semiconductor production tool includes sensing a signal associated with a test component of the production tool during operation of the production tool and converting the signal to an electronic test signal. A prerecorded signature signal corresponding to the test component is provided and the test signal and the prerecorded signature signal are compared.

Claims

1. A method for detecting a fault of a semiconductor production tool during an operation thereof, the method comprising the steps of:

sensing a signal associated with a test component of the semiconductor production tool during the operation of the semiconductor production tool;

converting the signal to an electronic test signal;

providing a prerecorded signature signal corresponding to the test component, the prerecorded signature signal created prior to the sensing; and

comparing the test signal and the prerecorded signature signal.

2. The method of claim 1, wherein the step of sensing the signal comprises the step of sensing the signal by at least one detection device associated with the test component.

3. The method of claim 1, wherein the step of sensing the signal comprises the step of sensing an acoustic, vibration or rotation, strain, optical or thermal signal.

4. The method of claim 1, wherein the step of providing the prerecorded signature signal corresponding to the test component comprises the step of prerecording a signal produced by the test component when the test component is operating in a known state.

5. The method of claim 4, wherein the step of prerecording comprises the step of prerecording a signal produced by the test component when the test component is functioning properly.

6. The method of claim 4, wherein the step of prerecording comprises the step of prerecording a signal produced by the test component when the test component is malfunctioning.

7. The method of claim 1, wherein the step of providing the prerecorded signature signal corresponding to the test component comprises the step of prerecording a signal produced by the test component when the test component is operating in isolation.

8. The method of claim 1, wherein the step of providing the prerecorded signature signal corresponding to the test component comprises the step of prerecording a signal produced by the test component when the test component is operating in the semiconductor production tool.

9. The method of claim 1, wherein the step of comparing the test signal and the prerecorded signature signal comprises the step of comparing the test signal to the prerecorded signature signal using voice recognition software.

10. The method of claim 1, wherein the step of comparing the test signal and the prerecorded signature signal comprises the step of comparing the test signal and the prerecorded signature signal in real time.

11. The method of claim 1, further comprising the step of providing a fault detection signal if the test signal substantially differs from the prerecorded signature signal corresponding to a properly operating state.

12. The method of claim 11, wherein the step of providing the fault detection signal comprises the step of providing a visual, audible, or electronic signal that indicates that a fault in the operation of the semiconductor production tool has been detected.

13. The method of claim 11, further comprising the step of terminating operation of the semiconductor production tool after the step of providing the fault detection signal.

14. The method of claim 11, further comprising the step of varying an operational parameter of the semiconductor production tool after the step of providing the fault detection signal.

15. The method of claim 1, further comprising the step of providing a fault detection signal if the test signal is substantially equivalent to the prerecorded signature signal corresponding to a malfunctioning state.

16. The method of claim 15, wherein the step of providing the fault detection signal comprises the step of providing a visual, audible, or electronic signal that indicates that a fault in the operation of the semiconductor production tool has been detected.

17. The method of claim 15, further comprising the step of terminating operation of the semiconductor production tool after the step of providing the fault detection signal.

18. The method of claim 15, further comprising the step of varying an operational parameter of the semiconductor production tool after the step of providing the fault detection signal.

19. A method for detecting a fault of a semiconductor production tool, the method comprising the steps of:

recording and storing a signature signal corresponding to a test component of the semiconductor production tool;

mounting at least one detection device so that it is capable of sensing a signal from the test component;

operating the semiconductor production tool after the step of recording and storing;

sensing a test signal produced by the test component during operation of the semiconductor production tool;

comparing the signature signal to the test signal; and

producing a fault detection signal based on results of the comparison of the signature signal and the test signal.

20. The method of claim 19, wherein the step of mounting at least one detection device so that it is capable of sensing a signal from the test component comprises the step of mounting the at least one detection device on the test component.

21. The method of claim 19, wherein the step of mounting at least one detection device so that it is capable of sensing a signal from the test component comprises the step of mounting the at least one detection device remotely from the test component.

22. The method of claim 19, further comprising the step of terminating operation of the semiconductor production tool after the step of producing the fault detection signal.

23. The method of claim 19, further comprising the step of varying at least one operational parameter of the semiconductor production tool after the step of producing the fault detection signal.

24. The method of claim 19, further comprising the step of determining a severity of a processing fault corresponding to the fault detection signal.

25. The method of claim 19, further comprising the step of determining the cause of a processing fault corresponding to the fault detection signal.

26. The method of claim 19, wherein the step of comparing the signature signal to the test signal comprises the step of comparing the signature signal to the test signal using voice recognition software.

27. A fault detection apparatus for a semiconductor production tool, wherein the fault detection apparatus comprises:

a detection device configured to sense a signal from a test component of the semiconductor production tool during operation of the semiconductor production tool and produce a test signal corresponding to the signal;

a signature signal database that stores a signature signal corresponding to operation of the test component in a known state, wherein the signature signal database is created before the detection device senses the signal; and

a comparator in electrical communication with the detection device and the signature signal database, wherein the comparator is configured to compare the test signal received from the detection device and the signature signal received from the signature signal database.

28. The fault detection apparatus of claim 27, wherein the detection device comprises a fiber optic acoustic detector, a piezoelectric or piezoresistive pressure sensor, a stethoscope, a laser microphone, a photodetector, an atomic force microscope, a laser interferometer, an accelerometer, an absorption or fluorescence spectrometer, a fiber Bragg grating, or a pyrometer.

29. The fault detection apparatus of claim 27, wherein the detection device is configured for mounting directly to the test component or mounting remotely from the test component.

30. The fault detection apparatus of claim 27, wherein the comparator comprises voice recognition software.

31. The fault detection apparatus of claim 27, wherein the comparator is configured to provide a fault detection signal if the test signal and the signature signal corresponding to a properly operating state are substantially different.

32. The fault detection apparatus of claim 27, wherein the comparator is configured to provide a fault detection signal if the test signal and the signature signal corresponding to a malfunctioning state are substantially equivalent.

33. The fault detection apparatus of claim 27, further comprising a controller that is configured to terminate operation of the semiconductor production tool upon receipt of a fault detection signal from the comparator.

34. The fault detection apparatus of claim 27, further comprising a controller that is configured to vary at least one operational parameter of the semiconductor production tool upon receipt of a fault detection signal from the comparator.