IC tag label

• US 8,120,496 B2
• Filed: 10/09/2007
• Issued: 02/21/2012
• Est. Priority Date: 10/12/2006
• Status: Active Grant

• Current Assignee: Dai Nippon Printing Company Limited
• Original Assignee: Dai Nippon Printing Company Limited
• Inventors: Ogata, Tetsuji
• Primary Examiner(s): Tweel, Jr., John A
• Application Number:
  US12/444,179
• Publication Number:
  US 20090303011A1
• Time in Patent Office: 1,596 Days
• Field of Search: 340/572.7, 340/572.8, 295/921, 29D/IG.1, 156/265
• US Class Current: 340/572.7
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: Y10T 156/1077 Applying plural cut laminae to single face of additional lamina

Abstract

An IC tag label includes an inlet substrate, an IC chip protection sheet, 4 which is mounted on one surface of the inlet substrate 11 and an antenna pattern and an IC chip which are mounted on the other surface of the inlet substrate. An adhesive layer is mounted on the other surface of the inlet substrate to cover the antenna pattern and IC chip. An opening, which serves as a clearance for the IC chip, is formed in a portion of the IC chip protection sheet-4, the portion corresponding to the IC chip.

Claims

1. An IC tag label comprising:

an inlet substrate;

an antenna pattern and an IC chip mounted on either one surface or the other surface of the inlet substrate;

an IC chip protection sheet mounted on one surface of the inlet substrate; and

an adhesive layer mounted on the other surface of the inlet substrate,

wherein a clearance for the IC chip is provided in a portion of the IC chip protection sheet, the portion corresponding to the IC chip, and

wherein the antenna pattern and the IC chip are mounted on one surface of the inlet substrate, and an additional film for covering the antenna pattern and the IC chip is disposed between the inlet substrate and the IC chip protection sheet.

4. The IC tag label according to claim 1, wherein an opening that serves as the clearance for the IC chip is provided in a portion of the IC chip protection sheet, the portion corresponding to the IC chip.

6. The IC tag label according to claim 1, wherein the IC chip protection sheet includes a plastic sheet and a protection sheet bond layer or adhesive layer, and has a thickness between 40 nm and 200 nm.

7. The IC tag label according to claim 1, wherein the IC chip protection sheet includes a paper substrate and a protection sheet bond layer or adhesive layer, and has a thickness between 40 nm and 200 nm.

2. An IC tag label comprising:

an inlet substrate;

an antenna pattern and an IC chip mounted on either one surface or the other surface of the inlet substrate;

an IC chip protection sheet mounted on one surface of the inlet substrate; and

an adhesive layer mounted on the other surface of the inlet substrate,

wherein a clearance for the IC chip is provided in a portion of the IC chip protection sheet, the portion corresponding to the IC chip, and

wherein a cut-out that is extended to one end edge of the IC chip protection sheet to provide the clearance for the IC chip is made in a portion of the IC chip protection sheet, the portion corresponding to the IC chip.

5. The IC tag label according to claim 2, wherein the antenna pattern and the IC chip are mounted on the other surface of the inlet substrate.

9. The IC tag label according to claim 2, wherein an opening that serves as the clearance for the IC chip is provided in a portion of the IC chip protection sheet, the portion corresponding to the IC chip.

11. The IC tag label according to claim 2, wherein the IC chip protection sheet includes a plastic sheet and a protection sheet bond layer or adhesive layer, and has a thickness between 40 nm and 200 nm.

13. The IC tag label according to claim 2, wherein the IC chip protection sheet includes a paper substrate and a protection sheet bond layer or adhesive layer, and has a thickness between 40 nm and 200 nm.

3. An IC tag label comprising:

an inlet substrate;

an antenna pattern and an IC chip mounted on either one surface or the other surface of the inlet substrate;

an IC chip protection sheet mounted on one surface of the inlet substrate; and

an adhesive layer mounted on the other surface of the inlet substrate,

wherein a clearance for the IC chip is provided in a portion of the IC chip protection sheet, the portion corresponding to the IC chip, and

wherein a belt-like groove that is extended from one end edge of the IC chip protection sheet to the other end edge thereof to provide the clearance for the IC chip is made in a portion of the IC chip protection sheet, the portion corresponding to the IC chip, and a pair of strip-shaped structures, which constitute the IC chip protection sheet, are formed on either side of the belt-like groove.

8. The IC tag label according to claim 3, wherein the antenna pattern and the IC chip are mounted on the other surface of the inlet substrate.

10. The IC tag label according to claim 3, wherein an opening that serves as the clearance for the IC chip is provided in a portion of the IC chip protection sheet, the portion corresponding to the IC chip.

12. The IC tag label according to claim 3, wherein the IC chip protection sheet includes a plastic sheet and a protection sheet bond layer or adhesive layer, and has a thickness between 40 nm and 200 nm.

14. The IC tag label according to claim 3, wherein the IC chip protection sheet includes a paper substrate and a protection sheet bond layer or adhesive layer, and has a thickness between 40 nm and 200 nm.