Multifunctional antenna chip

• US 8,120,545 B2
• Filed: 08/17/2009
• Issued: 02/21/2012
• Est. Priority Date: 08/17/2009
• Status: Active Grant

• Current Assignee: Auden Techno Corp.
• Original Assignee: Auden Techno Corp.
• Inventors: Tang, Chia-Lun, Lai, Shih-Chi
• Primary Examiner(s): PHAN, THO GIA
• Application Number:
  US12/542,093
• Publication Number:
  US 20110037678A1
• Time in Patent Office: 918 Days
• Field of Search: 343/700.MS, 343/702, 343/850, 343/860, 343/861
• US Class Current: 343/860
• CPC Class Codes: H01Q 1/2266 disposed inside the computer
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/36 Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewithH01Q1/08, H01Q1/14 take precedence
• CPC Class Codes: H01Q 9/0421 with a shorting wall or a shorting pin at one end of the element H01Q9/0414 takes precedence

Abstract

A multifunctional antenna chip is able to mate with many kinds of matched circuits and is able to adjust the character of an antenna structure of the multifunctional antenna chip, in order that the antenna structure has one or multiple standard working frequencies. The antenna structure is a folded antenna structure basically; this can save its volume occupied. And the multifunctional antenna chip has a non-signal inputting pin for connection to thereby increase shape of the antenna for adjusting the style of the antenna structure designed.

Claims

1. A multifunctional antenna chip mounted on an electric circuit board provided with a matched circuit for transmitting radio frequency signals, comprising:

a packing housing;

at least a dielectric layer base board provided in said packing housing and having a plurality of via holes;

an antenna structure at least includes an upper metallic layer and a lower metallic layer respectively allocated on an upper surface and a bottom surface of said dielectric layer base board;

said upper metallic layer and said lower metallic layer are connected with each other by said via holes to form a folded antenna structure; and

four connecting pins extended in said dielectric layer base board from four corners of said packing housing to connect said lower metallic layer;

after passing said matched circuit, radio frequency signals enter said antenna structure via one of a plurality of signal input connecting pins to form a mono-pole antenna, a character thus is provided that said antenna structure being adjusted by said matched circuit to render said antenna structure to have a working frequency meeting communication standard.

2. The multifunctional antenna chip as defined in claim 1, wherein another non-signal inputting connecting pin is connected to ground to transform said antenna structure into a plane inverted “

F”

antenna (PIFA) structure or an inverted “

F”

antenna (IFA) structure.

3. The multifunctional antenna chip as defined in claim 1, wherein said electric circuit board is provided thereon with a metallic wire segment of an antenna which is connected to a further non-signal inputting connecting pin to thereby change style of said antenna structure.

4. The multifunctional antenna chip as defined in claim 1, wherein multiple layers of said at least a dielectric layer base board are piled, every two of said dielectric layer base boards have therebetween a middle metallic layer, said two dielectric layer base boards are connected by means of a plurality of via holes with said upper metallic layer and said lower metallic layer respectively.

5. The multifunctional antenna chip as defined in claim 1, wherein electronic elements used in said matched circuit are chosen from a group including capacitors, inductances, adjustable capacitors, adjustable inductances or switches.

6. The multifunctional antenna chip as defined in claim 1, wherein said multifunctional antenna chip has a size 22.2×

7.2×

2.55 mm³.