Semiconductor cooling apparatus

• US 8,120,914 B2
• Filed: 10/24/2008
• Issued: 02/21/2012
• Est. Priority Date: 10/25/2007
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toyota Jidoshokki
• Original Assignee: Kabushiki Kaisha Toyota Jidoshokki
• Inventors: Kajiura, Katsuyuki
• Primary Examiner(s): Datskovskiy, Michail V
• Application Number:
  US12/257,857
• Publication Number:
  US 20090107655A1
• Time in Patent Office: 1,215 Days
• Field of Search: 361/679.46, 361/679.53, 361605-642, 361/688, 361/689, 361/699, 361704-712, 361718-724, 361/763, 361/766, 361/775, 361/782, 361/793, 361/794, 361/818, 165/80.3, 165/80.4, 165/80.5, 165/104.33, 165/104.34, 165/166, 165/167, 165/177, 165/185, 257706-727, 174/16.3, 174/252, 174/38, 363/56.02, 363/141, 363144-147, 363/137, 307/9.1, 307/10.1, 307/11, 307/38, 307/115, 622/281, 622/592, 294/17, 296/021, 295/921, 297/40, 297/41, 297/59, 298/32, 298/31, 298/40, 298/42
• US Class Current: 361/699
• CPC Class Codes: F28F 3/025 the means being corrugated, plate-like elements
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 24/33 of a plurality of layer connectors
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

A semiconductor cooling apparatus having a tank forming body and semiconductor power device mounting substrates is disclosed. The tank forming body includes a first outer plate, a second outer plate, a middle plate, a first inner fin, and a second inner fin. The middle plate is brazed to the outer periphery of the first outer plate and the outer periphery of the second outer plate. The first inner fin is brazed to the first outer plate. A first cooling medium passage is defined between the first outer plate and the first inner fin. A second cooling medium passage is defined between the first inner fin and the middle plate. The second inner fin is brazed to the second outer plate. A third cooling medium passage is defined between the second inner fin and the middle plate. A fourth cooling medium passage is defined between the second outer plate and the second inner fin. The middle plate has a plurality of through holes through which a second cooling medium passage and a third cooling medium passage communicate with each other. Each one of the mounting substrates includes a first surface on which a semiconductor power device is mounted and a second surface brazed to one of the first outer plate and the second outer plate.

Claims

1. A semiconductor cooling apparatus comprising:

a tank forming body, the tank forming body including;

a first outer plate;

a second outer plate;

a middle plate arranged between the first outer plate and the second outer plate, and outer periphery of the first outer plate and an outer periphery of the second outer plate being brazed to the middle plate;

a first inner fin with a corrugated plate-like shape arranged between the first outer plate and the middle plate, the first inner fin being brazed to at least one of the first outer plate and the middle plate, a first cooling medium passage being defined between the first outer plate and the first inner fin, a second cooling medium passage being defined between the first inner fin and the middle plate; and

a second inner fin with a corrugated plate-like shape arranged between the second outer plate and the middle plate, the second inner fin being brazed to at least one of the second outer plate and the middle plate, a third cooling medium passage being defined between the second inner fin and the middle plate, a fourth cooling medium passage defined between the second outer plate and the second inner fin, the middle plate having at least one through hole through which the second cooling medium passage and the third cooling medium passage communicate with each other; and

semiconductor power device mounting substrates each brazed to an outer surface of one of the first outer plate and the second outer plate, each semiconductor power device mounting substrate having an insulating substrate and metal layers formed on both surfaces of the insulating substrate, each semiconductor power device mounting substrate having a first surface on which a semiconductor power device is mounted and a second surface brazed to one of the first outer plate and the second outer plate,

wherein the first inner fin and the second inner fin each include a plurality of separate sections that are arranged to be mutually spaced.

2. The apparatus according to claim 1, wherein the tank forming body includes a positioning member that positions the separate sections.

3. The apparatus according to claim 2, wherein the positioning member includes a pair of projections engageable with two corner portions that are located diagonally in each of the separate sections.

4. The apparatus according to claim 1, wherein the middle plate includes a pair of communication holes through which a space including the first cooling medium passage and the second cooling medium passage and a space including the third cooling medium passage and the fourth cooling medium passage communicate with each other.