Tapered capacitive sensing structure

• US 8,121,283 B2
• Filed: 05/18/2006
• Issued: 02/21/2012
• Est. Priority Date: 05/18/2006
• Status: Active Grant

• Current Assignee: Wistron Corporation
• Original Assignee: Cypress Semiconductor Corporation (Infineon Technologies AG)
• Inventors: Peng, Tao, Qin, Zheng
• Primary Examiner(s): Jamal, Alexander
• Application Number:
  US11/437,507
• Publication Number:
  US 20070271399A1
• Time in Patent Office: 2,105 Days
• Field of Search: 379/433.07, 345/373, 345/374
• US Class Current: 379/433.07
• CPC Class Codes: G06F 3/03547 Touch pads, in which fingers can move on a surface
• CPC Class Codes: G06F 3/0442 using active external devices, e.g. active pens, for transmitting changes in electrical potential to be received by the digitiser
• CPC Class Codes: G06F 3/0443 using a single layer of sensing electrodes
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes

Abstract

A touchpad has interleaved conductive traces across a touchpad surface. Each conductive trace has a first end and a second end. The width of the first end is larger than the width of the second end. The interleaved conductive traces have a first group of conductive traces alternated with a second group of conductive traces.

Claims

1. An apparatus, comprising:

a first plurality of interleaved conductive traces of a touchpad disposed along a first axis,

wherein each conductive trace has a first end and a second end, the width of the first end being larger than the width of the second end,

wherein each of the first plurality of conductive traces is coupled to a corresponding capacitive sensing input, and

wherein the first plurality of conductive traces comprises a second plurality of conductive traces and a third plurality of conductive traces arranged alternately along a second axis.

2. The apparatus of claim 1, wherein the first end of the second plurality of conductive traces is adjacent to the second end of the third plurality of conductive traces.

3. The apparatus of claim 2, wherein the width of each conductive trace of the second plurality of conductive traces at the first end is larger than the width of each conductive trace of the third plurality of conductive traces at the second end.

4. The apparatus of claim 3, wherein the width of each conductive trace of the second plurality of conductive traces decreases gradually from the first end of the second plurality of conductive traces to the second end of the second plurality of conductive traces.

5. The apparatus of claim 4, wherein the width of each conductive trace of the third plurality of conductive traces decreases gradually from the first end of the third plurality of conductive traces to the second end of the third plurality of conductive traces.

6. The apparatus of claim 1, wherein one or more conductive trace of the second plurality of conductive traces is in the shape of a triangle, and one or more conductive trace of the third plurality of conductive traces is in the shape of a triangle.

7. The apparatus of claim 1, wherein the first plurality of interleaved conductive traces are on a same layer.

8. The apparatus of claim 1, wherein the second plurality of conductive traces is on a first plane, wherein the third plurality of conductive traces is on a second plane parallel to the first plane.

9. The apparatus of claim 1, comprising:

a circuit board having a first side and a second side, the first plurality of interleaved conductive traces formed on the first side; and

a processing device coupled to the second side of the circuit board.

10. The apparatus of claim 9, wherein the processing device is configured to measure capacitance on each of the corresponding capacitive sensing inputs.

11. The apparatus of claim 9, wherein the first plurality of interleaved conductive traces form a single layer on the first side of the circuit board.

12. The apparatus of claim 9, comprising:

an overlay adhered to the first side of the circuit board with a non-conductive adhesive layer.

13. A method for manufacturing a touchpad, comprising:

providing a circuit board having a first side and a second side;

forming on a plane, a plurality of interleaved pairs of conductive traces of a touchpad on the first side of the circuit board,

wherein each conductive trace has a first end and a second end, the width of the first end being larger than the width of the second end,

wherein each conductive trace is formed along a first axis,

wherein the plurality of interleaved pairs is arranged along a second axis, the second axis substantially orthogonal to the first axis, and

wherein each of the plurality of conductive traces is coupled to a corresponding capacitive sensing input.

14. A method for operating a touchpad, comprising:

providing a single layer of a plurality of interleaved pairs of conductive traces of a touchpad, each pair of conductive traces comprising a first conductive trace and a second conductive trace, each conductive trace having a first end and a second end, the width of the first end being larger than the width of the second end,

wherein the first end of the first conductive trace is adjacent to the second end of the second conductive trace and the second end of the first conductive trace is adjacent to the first end of the second conductive trace, and

wherein each of the conductive trace of the plurality of interleaved pairs of conductive traces is coupled to a corresponding capacitive sensing input;

measuring a capacitance variation of a conductive trace;

comparing a capacitance variation of at least one adjacent conductive trace to the conductive trace; and

determining a two-dimensional coordinate position on the touchpad based on the comparison.

15. The method of claim 14, wherein determining a two-dimensional coordinate position comprises:

determining a first axis position of the touchpad based on the measurement; and

determining a second axis position of the touchpad using the comparison.

16. An apparatus, comprising:

a circuit board; and

means for measuring a two-dimensional coordinate position on a touchpad comprising the circuit board,

wherein the means for measuring are in a same layer and comprise a plurality of interleaved conductive traces, wherein each conductive trace has a first end and a second end, the width of the first end being larger than the width of the second end, and

wherein each of the plurality of conductive traces is coupled to a corresponding capacitive sensing input.

17. The apparatus of claim 16, wherein the plurality of interleaved conductive traces comprises a first group of conductive traces alternated with a second group of conductive traces.