Method for manufacturing electronic device

• US 8,121,394 B2
• Filed: 03/18/2008
• Issued: 02/21/2012
• Est. Priority Date: 03/19/2007
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Miyauchi, Takashi
• Primary Examiner(s): NGUYEN, SANG H
• Application Number:
  US12/050,598
• Publication Number:
  US 20080232673A1
• Time in Patent Office: 1,435 Days
• Field of Search: 382/141, 382/143, 382/145, 382/147, 382/149, 382/150, 382/129, 382/146, 252/512, 252/513, 252/514, 257/780, 257/781, 257/737
• US Class Current: 382/145
• CPC Class Codes: G02F 1/1303 Apparatus specially adapted to the manufacture of LCDs
• CPC Class Codes: G02F 1/1309 Repairing; Testing
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: H01L 2224/29075 Plural core members
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/293 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/81903 by means of a layer connector
• CPC Class Codes: H01L 2224/83851 being an anisotropic conductive adhesive
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H05K 1/0269 for visual or optical inspection
• CPC Class Codes: H05K 2201/0108 Transparent
• CPC Class Codes: H05K 2201/0382 Continuously deformed conductors
• CPC Class Codes: H05K 2203/163 Monitoring a manufacturing process
• CPC Class Codes: H05K 3/323 by applying an anisotropic conductive adhesive layer over an array of pads

Abstract

A method for manufacturing an electronic device is provided. The method includes: pressure-bonding a plurality of terminals of an electronic component to a plurality of electrodes formed on a surface of a transparent substrate, respectively, via an anisotropic conductive film to mount the electronic component on the transparent substrate; obtaining an image of the electrodes by imaging the transparent substrate with the electronic component mounted thereon from backside of the transparent substrate; measuring the number of indentations for each said electrode using the image of the electrode, the indentation being formed when the electrode is pressed by a conductive particle in the anisotropic conductive film; calculating an average and a standard deviation of the number of indentations per electrode throughout the transparent substrate; and calculating a probability that the number of indentations per electrode is less than a reference value on basis of the average and the standard deviation.

Claims

1. A method for manufacturing an electronic device, comprising:

pressure-bonding a plurality of terminals of an electronic component to a plurality of electrodes formed on a surface of a transparent substrate, respectively, via an anisotropic conductive film to mount the electronic component on the transparent substrate;

obtaining an image of the electrodes by imaging the transparent substrate with the electronic component mounted thereon from backside of the transparent substrate;

measuring the number of indentations for each said electrode using the image of the electrode, the indentation being formed when the electrode is pressed by a conductive particle in the anisotropic conductive film;

calculating an average and a standard deviation of the number of indentations per electrode throughout the transparent substrate by an indentation tester; and

calculating a probability that the number of indentations per electrode is less than a reference value on basis of the average and the standard deviation by the indentation tester.

2. The method for manufacturing an electronic device according to claim 1, wherein

the obtaining an image of the electrodes includes:

obtaining an image of the transparent substrate with the electronic component mounted thereon by using a differential interference microscope to form an optical picture of the transparent substrate with the electronic component mounted thereon as viewed from the backside of the transparent substrate and by using an imager to image the optical picture; and

detecting a region corresponding to the electrode in the image by matching the image with data representative of a shape of the electrode, and the measuring the number of indentations includes;

extracting indentation candidate regions by matching a reference image of the indentation with the region corresponding to the electrode;

extracting, as indentation regions, the indentation candidate regions with contrast difference therein being not less than a preset value; and

counting the number of indentation regions in each said region corresponding to the electrode.

3. The method for manufacturing an electronic device according to claim 2, wherein

the measuring the number of indentations further includes:

applying differential filtering to the region corresponding to the electrode.

4. The method for manufacturing an electronic device according to claim 1, further comprising:

determining a mounting state of the electronic device to be non-defective when the number of indentations in all the electrodes is not less than the reference value, and determining a mounting state of the electronic device to be defective at all other times.

5. The method for manufacturing an electronic device according to claim 1, further comprising:

testing whether a distribution of the number of indentations per electrode throughout the transparent substrate follows a normal distribution.

6. The method for manufacturing an electronic device according to claim 1, further comprising:

issuing an alarm when the probability is not less than a prescribed value.

7. The method for manufacturing an electronic device according to claim 1, further comprising:

calculating an average and a standard deviation of the number of indentations per electrode for each manufacturing factor of the electronic device; and

calculating a probability that the number of indentations per electrode is less than the reference value on basis of the average and the standard deviation calculated for each said manufacturing factor.

8. The method for manufacturing an electronic device according to claim 7, further comprising:

presenting a variation with time of the probability.

9. The method for manufacturing an electronic device according to claim 7, wherein the manufacturing factor is a type of the electronic component, a type of the transparent substrate, or an apparatus used for mounting the electronic component.

10. The method for manufacturing an electronic device according to claim 1, wherein the electronic component is a liquid crystal display.

11. A method for testing an electronic device including a transparent substrate and an electronic component mounted on the transparent substrate by pressure-bonding a plurality of terminals of the electronic component to a plurality of electrodes formed on a surface of the transparent substrate, respectively, via an anisotropic conductive film, comprising;

obtaining an image of the electrodes by imaging the transparent substrate with the electronic component mounted thereon from backside of the transparent substrate;

measuring the number of indentations for each said electrode using the image of the electrode, the indentation being formed when the electrode is pressed by a conductive particle in the anisotropic conductive film;

calculating an average and a standard deviation of the number of indentations per electrode throughout the transparent substrate by an indentation tester; and

calculating a probability that the number of indentations per electrode is less than a reference value on basis of the average and the standard deviation by the indentation tester.

12. The method for testing an electronic device according to claim 11, wherein

the obtaining an image of the electrodes includes:

obtaining an image of the transparent substrate with the electronic component mounted thereon by using a differential interference microscope to form an optical picture of the transparent substrate with the electronic component mounted thereon as viewed from the backside of the transparent substrate and by using an imager to image the optical picture; and

detecting a region corresponding to the electrode in the image by matching the image with data representative of a shape of the electrode, and the measuring the number of indentations includes;

extracting indentation candidate regions by matching a reference image of the indentation with the region corresponding to the electrode;

extracting, as indentation regions, the indentation candidate regions with contrast difference therein being not less than a preset value; and

counting the number of indentation regions in each said region corresponding to the electrode.

13. The method for testing an electronic device according to claim 12, wherein

the measuring the number of indentations further includes:

applying differential filtering to the region corresponding to the electrode.

14. The method for testing an electronic device according to claim 11, further comprising:

determining a mounting state of the electronic device to be non-defective when the number of indentations in all the electrodes is not less than the reference value, and determining a mounting state of the electronic device to be defective at all other times.

15. The method for testing an electronic device according to claim 11, further comprising:

testing whether a distribution of the number of indentations per electrode throughout the transparent substrate follows a normal distribution.

16. The method for testing an electronic device according to claim 11, further comprising:

issuing an alarm when the probability is not less than a prescribed value.

17. The method for testing an electronic device according to claim 11, further comprising:

calculating an average and a standard deviation of the number of indentations per electrode for each manufacturing factor of the electronic device; and

calculating a probability that the number of indentations per electrode is less than the reference value on basis of the average and the standard deviation calculated for each said manufacturing factor.

18. The method for testing an electronic device according to claim 17, further comprising:

displaying a variation with time of the probability.

19. The method for testing an electronic device according to claim 17, wherein the manufacturing factor is a type of the electronic component, a type of the transparent substrate, or an apparatus used for mounting the electronic component.

20. The method for testing an electronic device according to claim 11, wherein the electronic component is a liquid crystal display.