Integrated circuit with intra-chip and extra-chip RF communication
First Claim
1. An integrated circuit comprising:
- a first integrated circuit die having a first circuit and a first intra-chip interface; and
a second integrated circuit die having a second circuit and a second intra-chip interface and a remote interface, wherein the first intra-chip interface and the second intra-chip interface electro-magnetically communicate first signals between the first circuit and the second circuit, and wherein the remote interface is coupled to engage in electromagnetic communications with a remote device; and
a shielding element, to shield the electromagnetic communications with the remote device from the electromagnetic communication of the first signals;
wherein the first intra-chip interface and the second intra-chip interface electro-magnetically communicate the first signals via millimeter wave RF communication.
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Accused Products
Abstract
An integrated circuit includes a first integrated circuit die having a first circuit and a first intra-chip interface and a second integrated circuit die having a second circuit and a second intra-chip interface and a remote interface, wherein the first intra-chip interface and the second intra-chip interface electro-magnetically communicate first signals between the first circuit and the second circuit, and wherein the remote interface is coupled to engage in electromagnetic communications with a remote device. In an embodiment of the present invention, a shielding element shields the electromagnetic communications with the remote device from the electromagnetic communication of the first signals. In other embodiments, antenna beam patterns or differing polarizations are used to isolate the electromagnetic communications with the remote device from the electromagnetic communication of the first signals.
102 Citations
14 Claims
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1. An integrated circuit comprising:
- a first integrated circuit die having a first circuit and a first intra-chip interface; and
a second integrated circuit die having a second circuit and a second intra-chip interface and a remote interface, wherein the first intra-chip interface and the second intra-chip interface electro-magnetically communicate first signals between the first circuit and the second circuit, and wherein the remote interface is coupled to engage in electromagnetic communications with a remote device; and
a shielding element, to shield the electromagnetic communications with the remote device from the electromagnetic communication of the first signals;
wherein the first intra-chip interface and the second intra-chip interface electro-magnetically communicate the first signals via millimeter wave RF communication. - View Dependent Claims (2, 3, 4)
- a first integrated circuit die having a first circuit and a first intra-chip interface; and
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5. An integrated circuit comprising:
- a first integrated circuit die having a first circuit and a first intra-chip interface; and
a second integrated circuit die having a second circuit, a second intra-chip interface and a remote interface, wherein the first intra-chip interface and the second intra-chip interface electro-magnetically communicate first signals between the first circuit and the second circuit in accordance with a first polarization, and wherein the remote interface is coupled to engage in electromagnetic communications with a remote device in accordance with a second polarization;
wherein the first polarization differs from the second polarization to isolate the electro-magnetic communication of the first signals from the electromagnetic communications with the remote device;
wherein the first intra-chip interface and the second intra-chip interface electro-magnetically communicate the first signals via millimeter wave RF communication. - View Dependent Claims (6, 7, 8)
- a first integrated circuit die having a first circuit and a first intra-chip interface; and
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9. An integrated circuit comprising:
- a first integrated circuit die having a first circuit and a first intra-chip interface having a first antenna; and
a second integrated circuit die having a second circuit, a second intra-chip interface having a second antenna and a remote interface having a third antenna, wherein the first intra-chip interface and the second intra-chip interface electro-magnetically communicate first signals between the first circuit and the second circuit in accordance with a directional beam pattern established by one of;
the first antenna and the second antenna to reduce interference with the remote interface, and wherein the remote interface is coupled to engage in electromagnetic communications with a remote device;
wherein the first intra-chip interface and the second intra-chip interface electro-magnetically communicate the first signals via millimeter wave RF communication. - View Dependent Claims (10, 11)
- a first integrated circuit die having a first circuit and a first intra-chip interface having a first antenna; and
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12. An integrated circuit comprising:
- a first integrated circuit die having a first circuit and a first intra-chip interface having a first antenna; and
a second integrated circuit die having a second circuit, a second intra-chip interface having a second antenna and a remote interface having a third antenna, wherein the first intra-chip interface and the second intra-chip interface electro-magnetically communicate first signals between the first circuit and the second circuit, and wherein the remote interface is coupled to engage in electromagnetic communications with a remote device and wherein the third antenna produces a directional beam pattern to reduce interference with the first intra-chip interface and the second intra-chip interface;
wherein the first intra-chip interface and the second intra-chip interface electro-magnetically communicate the first signals via millimeter wave RF communication. - View Dependent Claims (13, 14)
- a first integrated circuit die having a first circuit and a first intra-chip interface having a first antenna; and
Specification