Process for packaging electronic devices

• US 8,124,173 B2
• Filed: 12/08/2008
• Issued: 02/28/2012
• Est. Priority Date: 12/16/2002
• Status: Active Grant

• Current Assignee: UBE Industries Limited
• Original Assignee: UBE Industries Limited
• Inventors: Naiki, Masahiro, Kinouchi, Masayuki, Ishikawa, Seiji, Matsui, Yuji, Tanaka, Yoshiki
• Primary Examiner(s): Talbot, Brian K
• Application Number:
  US12/329,960
• Publication Number:
  US 20090092748A1
• Time in Patent Office: 1,177 Days
• Field of Search: 427/96.2, 427/96.4, 298/55, 298/85
• US Class Current: 427/96.2
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/296 Organo-silicon compounds
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 2201/0162 Silicon containing polymer, e.g. silicone
• CPC Class Codes: H05K 3/285 Permanent coating compositions
• CPC Class Codes: H05K 3/3452 Solder masks
• CPC Class Codes: Y10T 29/49171 with encapsulating
• CPC Class Codes: Y10T 29/49224 with coating

Abstract

A process for packaging an electronic device employs an insulating protective resin layer produced from one or more of the resin compositions: (1) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.5 to 30 parts of an epoxy compound having an epoxy equivalent of more than 800, and an organic solvent, (2) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 10 parts of an epoxy compound having an epoxy equivalent of 100 to 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent; and (3) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 20 parts of an epoxy compound having an epoxy equivalent of more than 800, 2 to 30 parts of a polyvalent isocyanate compound, and an organic solvent.

Claims

1. A process for packaging an electronic device comprising the steps of:

preparing a printed wiring board which has wiring copper layers coated with a metal layer comprising tin;

coating the metal layer with an insulating protective resin layer, keeping an area for mounting an electronic device exposed;

mounting the electronic device on the exposed area via an electroconductive material comprising gold; and

coating the mounted electronic device and a portion of the insulating protective resin layer with an encapsulant;

wherein the insulating protective resin layer is produced by employing at least one of the following resin compositions (1) to (3);

(1) a resin composition comprising 100 weight parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.5 to 30 weight parts of an epoxy compound having an epoxy equivalent of more than 800, and an organic solvent;

(2) a resin composition comprising 100 weight parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 10 weight parts of an epoxy compound having an epoxy equivalent of 100 to 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent; and

(3) a resin composition comprising 100 weight parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 20 weight parts of an epoxy compound having an epoxy equivalent of more than 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent.

2. The process of claim 1, wherein the organic solvent-soluble resin is an organic solvent-soluble polyimide-siloxane.

3. The process of claim 2, wherein the organic solvent-soluble polyimide siloxane is produced by a reaction of a tetracarboxylic acid compound with a diamine compound comprising 30 to 95 mol. % of a diaminopolysiloxane compound, 0.5 to 40 mol. % of an aromatic diamine compound having a polar group on an aromatic ring thereof and 0 to 69.5 mol. % of an diamine compound other than the aromatic diamine compound.

4. The process of claim 1, wherein the resin composition contains a curing catalyst.

5. The process of claim 1, wherein the resin composition contains a filler.

6. The process of claim 1, wherein the resin composition is curable at a temperature of lower than 130°

C.