Method and system for packaging a display
First Claim
Patent Images
1. A method of manufacturing a display device, comprising:
- providing a transparent substrate having an interferometric modulator formed thereon; and
joining a backplane to the transparent substrate to form a package by applying a seal between the backplane and the transparent substrate, wherein the interferometric modulator is encapsulated by the package and the package has at least one opening.
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Abstract
A package structure and method of packaging for an interferometric modulator. A transparent substrate having an interferometric modulator formed thereon is provided. A backplane is joined to the transparent substrate with a seal where the interferometric modulator is exposed to the surrounding environment through an opening in either the backplane or the seal. The opening is sealed after the transparent substrate and backplane are joined and after any desired desiccant, release material, and/or self-aligning monolayer is introduced into the package structure.
388 Citations
20 Claims
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1. A method of manufacturing a display device, comprising:
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providing a transparent substrate having an interferometric modulator formed thereon; and joining a backplane to the transparent substrate to form a package by applying a seal between the backplane and the transparent substrate, wherein the interferometric modulator is encapsulated by the package and the package has at least one opening. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification