Method for making an optical device with integrated optoelectronic components

• US 8,124,439 B2
• Filed: 05/19/2009
• Issued: 02/28/2012
• Est. Priority Date: 05/21/2008
• Status: Active Grant

• Current Assignee: Commissariat a L'Energie Atomique (AES Corporation)
• Original Assignee: Commissariat a L'Energie Atomique (AES Corporation)
• Inventors: Bolis, Sebastien
• Primary Examiner(s): Parendo, Kevin
• Application Number:
  US12/992,714
• Publication Number:
  US 20110086461A1
• Time in Patent Office: 1,015 Days
• Field of Search: 438/65, 438/456, 438/458, 438/459, 438/69, 438/75, 438/98, 438/667, 257/E31.127
• US Class Current: 438/65
• CPC Class Codes: G02B 13/001 Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras G02B23/243 takes precedence
• CPC Class Codes: G02B 13/0085 employing wafer level optics
• CPC Class Codes: H01L 27/14609 Pixel-elements with integrated switching, control, storage or amplification elements scanning details of imagers (circuitry of solid-state image sensors H04N25/00); circuitry of imagers H04N25/70
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 27/14696 The active layers comprising only AIIBVI compounds, e.g. CdS, ZnS, CdTe
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

A method for making an optical device with integrated optoelectronic components, including a) making a protective structure including a support in which at least one blind hole is made, an optical element being positioned in the blind hole, b) attaching the support to a substrate including the integrated optoelectronic components, the blind hole forming a cavity in which the optical element faces one of the optoelectronic components, c) achieving thinning of the substrate and making electric connections through the substrate, and d) making an aperture through the bottom wall of the blind hole, uncovering at least one portion of the optical field of the optical element.

Claims

1. A method for making an optical device with integrated optoelectronic components, comprising:

a) making a protective structure comprising at least one support in which at least one blind hole is made in the at least one support, at least one optical element being positioned in the blind hole and attached to at least one surface of the blind hole;

b) then attaching a face of the support to a substrate comprising the integrated optoelectronic components, the blind hole forming a cavity in which the at least one optical element faces one of the optoelectronic components;

c) then performing thinning of the substrate and making electric connections through the substrate; and

d) then making at least one aperture through the protective structure and a bottom surface of the blind hole, uncovering at least one portion of an optical field of the at least one optical element.

2. The method according to claim 1, wherein the making electric connections in the step c) includes making the electric connections through the substrate and the support.

3. The method according to claim 1, wherein the at least one optical element comprises at least one of:

glass, an organic material, or germanium.

4. The method according to claim 1, wherein the at least one optical element includes at least one of:

a plate with parallel faces, a lens, or a lens having an index gradient.

5. The method according to claim 1, wherein the support includes a planar rear face, opposite to a face attached to the substrate.

6. The method according to claim 1, wherein the integrated optoelectronic components include at least one of CMOS or CCD imagers.

7. The method according to claim 1, wherein the support comprises a material having a heat expansion coefficient similar to that of a material of the substrate.

8. The method according to claim 1, wherein, during the attaching the support to the substrate in the step b), the support is attached to the substrate via spacer elements.

9. The method according to claim 1, further comprising thinning the support.

10. The method according to claim 1, wherein the making the protective structure in the step a) comprises:

making a first stack including a first mechanical layer and a second layer that comprises at least one material forming the at least one optical element;

etching the second layer, wherein at least one remaining portion of the second layer forms the at least one optical element;

making a second stack including a third layer and a fourth layer;

etching at least one hole through the fourth layer;

attaching the first and second stacks, wherein remaining portions of the fourth layer are positioned against a face of the first layer and wherein the at least one optical element is positioned in the hole etched through the fourth layer; and

removing the third layer.

11. The method according to claim 10, wherein the removing the third layer includes totally thinning the third layer or disassembling the third layer, wherein the dissembling occurs when the third layer is attached by a temporary adhesive bonding to the fourth layer.

12. The method according to claim 1, wherein the making the protective structure in the step a) comprises:

making a first stack including a first layer and a second layer that comprises at least one material forming the at least one optical element;

etching the second layer, wherein at least one remaining portion of the second layer forms the at least one optical element;

depositing an adhesive bonding interface on at least the at least one optical element;

making a second stack including a third mechanical layer and a fourth layer;

etching at least one hole through the fourth layer;

attaching the first and second stacks, wherein the third layer is positioned against the adhesive bonding interface and wherein the at least one optical element is positioned in the hole etched through the fourth layer; and

removing the first layer.

13. The method according to claim 1, wherein the making the protective structure in step a) comprises:

making the support in which the blind hole is made; and

positioning and attaching the at least one optical element in the blind hole via at least one attachment material positioned beforehand at least on one surface of the blind hole or on the at least one optical element.

14. The method according to claim 1, further comprising depositing at least one layer, which is at least partly opaque in a range of operating wavelengths of the optoelectronic component or which is electrically conducting, on at least one part of the surfaces of the blind hole.

15. The method according to claim 14, wherein the at least one layer is deposited at least on a part of the face of the support attached to the substrate.

16. The method according to claim 1, further comprising, during the step a), making at least one of an optical or electromagnetic protection between the support and the at least one optical element.

17. The method according to claim 1, wherein the support is formed from a single layer, and the blind hole is obtained by etching in the single layer.

18. The method according to claim 1, further comprising, after the making the at least one aperture in the step d), depositing at least one layer that is at least partly opaque in a range of operating wavelengths of the optoelectronic component or that is electrically conducting on a wall of the aperture or on a rear of the support, opposite to the face of the support attached to the substrate.

19. The method according to claim 1, further comprising, after the making the at least one aperture in the step d), adding at least one optical stack to a rear face of the support, opposite to the face of the support attached to the substrate.

20. The method according to claim 19, further comprising, after the adding the optical stack, making electric connections to the optoelectronic components, or, wherein the optical stack includes plural optical elements, making electric connections to the plural optical elements.

21. The method according to claim 19, further comprising making an optical or electromagnetic protection on the at least one optical stack.

22. The method according to claim 21, further comprising, after making the optical or electromagnetic protection, making at least one aperture through the optical or electromagnetic protection.

23. The method according to claim 19, further comprising making an optical and electromagnetic protection on the at least one optical stack.

24. The method according to claim 23, further comprising, after making the optical and electromagnetic protection, making at least one aperture through the optical and electromagnetic protection.

25. The method according to claim 19, wherein the protective structure includes plural optical elements, and further comprising making electric connections to the plural optical elements.

26. The method according to claim 1, wherein the performing thinning in the step c) includes thinning the support.

27. The method according to claim 1, wherein the making electric connections in the step c) further includes making the electric connections between the substrate and the support.

28. The method according to claim 1, further comprising depositing a layer which is partly opaque in a range of operating wavelengths of the optoelectronic component and a layer which is electrically conducting on at least one part of the surfaces of the blind hole.

29. The method according to claim 28, wherein the layer which is partly opaque in the range of operating wavelengths of the optoelectronic component and the layer which is electrically conducting are deposited at least on a part of the face of the support attached to the substrate.

30. The method according to claim 1, further comprising, during the step a), making an optical and electromagnetic protection between the support and the at least one optical element.

31. The method according to claim 1, further comprising, after the making the at least one aperture in the step d), depositing a layer that is at least partly opaque in a range of operating wavelengths of the optoelectronic component and a layer that is electrically conducting on a wall of the aperture or on a rear support, opposite to the face of the support attached to the substrate.

32. The method according to claim 1, further comprising depositing at least one layer, which is at least partly opaque in a range of operating wavelengths of the optoelectronic component or which is electrically conducting, at least on a part of the face of the support attached to the substrate.

33. The method according to claim 1, further comprising depositing a layer which is partly opaque in a range of operating wavelengths of the optoelectronic component and a layer which is electrically conducting at least on a part of the face of the support attached to the substrate.