Sensor device having a porous structure element
First Claim
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1. A sensor device, comprising:
- a first semiconductor chip having a sensing region;
a porous structure element comprising an interconnected network of pores, the porous structure element attached to the first semiconductor chip with a first region of the porous structure element facing the sensing region of the first semiconductor chip; and
an encapsulation material partially encapsulating the first semiconductor chip and the porous structure element.
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Abstract
A sensor device and method. One embodiment provides a first semiconductor chip having a sensing region. A porous structure element is attached to the first semiconductor chip. A first region of the porous structure element faces the sensing region of the first semiconductor chip. An encapsulation material partially encapsulates the first semiconductor chip and the porous structure element.
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Citations
17 Claims
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1. A sensor device, comprising:
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a first semiconductor chip having a sensing region; a porous structure element comprising an interconnected network of pores, the porous structure element attached to the first semiconductor chip with a first region of the porous structure element facing the sensing region of the first semiconductor chip; and an encapsulation material partially encapsulating the first semiconductor chip and the porous structure element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A sensor device, comprising:
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a first semiconductor chip having a sensing region; a porous structure element comprising an interconnected network of pores, the porous structure element having a first side attached to the first semiconductor chip, the porous structure element comprising a first region facing the sensing region of the first semiconductor chip and an exposed second region in fluid connection with the first region; and an encapsulation material partially encapsulating the first semiconductor chip and the porous structure element. - View Dependent Claims (13, 14, 15, 16, 17)
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Specification