Low resistance tunnel junctions in wide band gap materials and method of making same

• US 8,124,957 B2
• Filed: 02/22/2006
• Issued: 02/28/2012
• Est. Priority Date: 02/22/2006
• Status: Active Grant

• Current Assignee: MACOM Technology Solutions Holdings, Inc.
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Ibbetson, James P., Keller, Bernd P., Mishra, Umesh K.
• Primary Examiner(s): GEBREMARIAM, SAMUEL A
• Application Number:
  US11/360,166
• Publication Number:
  US 20070194300A1
• Time in Patent Office: 2,197 Days
• Field of Search: 257 12- 13
• US Class Current: 257/12
• CPC Class Codes: H01L 29/2003 Nitride compounds
• CPC Class Codes: H01L 29/205 in different semiconductor regions , e.g. heterojunctions
• CPC Class Codes: H01L 29/88 Tunnel-effect diodes

Abstract

A low resistance tunnel junction that uses a natural polarization dipole associated with dissimilar materials to align a conduction band to a valence band is disclosed. Aligning the conduction band to the valence band of the junction encourages tunneling across the junction. The tunneling is encouraged, because the dipole space charge bends the energy bands, and shortens a tunnel junction width charge carriers must traverse to tunnel across the junction. Placing impurities within or near the tunnel junction that may form deep states in the junction may also encourage tunneling in a tunnel junction. These states shorten the distance charge carriers must traverse across the tunnel junction.

Claims

1. A low resistance tunnel junction structure, comprising:

first and second semiconductor layers, said first layer being degenerately doped n-type such that its Fermi level is located in or near its conduction band, and said second layer being degenerately doped p-type such that its Fermi level is located in or near its valence band;

a metal contact forming a junction with one of said first layer or second layer, and a substrate forming a junction with the other one of said first layer or second layer;

a third semiconductor layer having a dissimilar composition from said first and second layers sandwiched between, in contact with and forming first and second heterojunction contacts with said first and second layers respectively; and

said first, second and third layers establishing a tunnel junction and having an associated natural polarization dipole that aligns said first layer'"'"'s conduction band to said second layer'"'"'s valence band so that the tunnel junction width is smaller than it would be in the absence of said third layer.

2. The junction structure of claim 1, wherein said third layer is approximately 0.3 to 5 nanometers thick.

3. The junction structure of claim 1, wherein said structure comprises a periodic table group III-nitride material system.

4. The junction structure of claim 1, wherein said third layer forms abrupt transitions with said first and second layers.

5. The junction structure of claim 1, wherein said third layer forms graded transitions with said first and second layers.

6. The junction structure of claim 1, further comprising:

an electron barrier in said first layer of highly doped n-type GaN spaced from said junction, and a hole barrier in said second layer of highly doped p-type GaN spaced from said junction.

7. The junction structure of claim 1, wherein said metal contact forms a junction with said first layer, and said substrate forms a junction with said second layer, said first and second layers respectively comprising highly doped n-type gallium nitride (GaN) and highly doped p-type GaN.

8. The junction structure of claim 7, wherein said third layer comprises indium gallium nitride.

9. The junction structure of claim 1, wherein said substrate forms a junction with said first layer, and said metal contact forms a junction with said second layer, said first and second layers respectively comprising highly doped n-type gallium nitride (GaN) and highly doped p-type GaN.

10. The junction structure of claim 9, wherein said third layer comprises aluminum gallium nitride (Al_xGa_yN), where x+y=1.

11. The junction structure of claim 1, further comprising:

an impurity in the vicinity of said third layer that forms a band gap state that reduces the width of said tunnel junction.

12. The junction structure of claim 11, wherein said band gap state forms at least one intermediate state that provides tunneling targets between said conduction and valence bands.

13. A low resistance tunnel junction structure comprising:

a first layer of a first material having a first type of doping such that its Fermi level is in or near a first energy band, wherein said first layer is degenerately doped with said first type of doping,

a second layer of a second material in semiconductor junction contact with said first layer,

a third layer of said first material having a second type of doping such that its Fermi level is in or near a second energy band in semiconductor junction contact with said second layer, wherein said third layer is degenerately doped with said second type of doping, said first, second and third layers establish a tunnel junction and having an associated polarization dipole generated by the presence of said second layer that aligns said first layers said first band to said third layers said second band and forms a tunnel junction width that is smaller than it would be in the absence of said second layer; and

a metal contact forming a junction with one of said first layer or second layer, and a substrate forming a junction with the other one of said first layer or second layer.

14. The junction structure of claim 13, wherein said second layer is approximately 0.3 to 5 nanometers thick.

15. The junction structure of claim 13, wherein said second layer forms abrupt transitions with said first and third layers.

16. The junction structure of claim 13, wherein said second layer forms graded transitions with said first and third layers.

17. The junction structure of claim 13, wherein said structure comprises a periodic table group III-nitride material system.

18. The junction structure of claim 17, further comprising:

a fourth layer of said first material having said second type of doping in semiconductor junction contact with and supporting said third layer, wherein said first layer is a n-type GaN layer, said third layer is a p-type GaN layer, and said second layer is a In_xGa_yN layer, where x+y=1.

19. The junction structure of claim 17, further comprising:

a fourth layer of said first material having said second type of doping in semiconductor junction contact with and supporting said third layer wherein said first layer is a p-type GaN layer, said third layer is a n-type GaN layer, and said second layer is a Al_xGa_yN layer, where x+y=1.

20. The junction structure of claim 13, further comprising:

an impurity in the vicinity of said second layer that forms a band gap state that reduces the width of said tunnel junction.

21. The junction structure of claim 20, wherein said impurity forms at least one intermediate state that provides tunneling targets within said tunnel junction.