Gate of trench type MOSFET device and method for forming the gate
First Claim
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1. An apparatus comprising:
- a first gate oxide film formed over a trench region;
a first polysilicon film deposited over said first gate oxide film to have a predetermined thickness;
a second gate oxide film deposited over said first polysilicon film; and
a second polysilicon film over said second gate oxide film,wherein said predetermined thickness of said first polysilicon film is between approximately 500 Å and
1000 Å
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Abstract
A gate of a trench type MOSFET device and a method of forming a gate. A gate of a trench type MOSFET device may include a gate oxide film formed on and/or over a trench type gate poly such that parasitic capacitance may be produced in a gate poly. An electric field may be substantially uniformly formed in a MESA region surrounding a gate poly. An overcurrent may be substantially prevented from flowing into a MOS channel around a gate. A gate oxide film may be substantially prevented from being destroyed and/or leakage may be substantially prevented. Reliability of a device may be maximized.
18 Citations
18 Claims
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1. An apparatus comprising:
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a first gate oxide film formed over a trench region; a first polysilicon film deposited over said first gate oxide film to have a predetermined thickness; a second gate oxide film deposited over said first polysilicon film; and a second polysilicon film over said second gate oxide film, wherein said predetermined thickness of said first polysilicon film is between approximately 500 Å and
1000 Å
. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method comprising:
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forming a first gate oxide film over a trench region; forming a first polysilicon film over a surface of a semiconductor substrate in which the trench region is formed and the first gate oxide film; forming a photoresist mask over said first polysilicon film exposing the first polysilicon film over said trench region; etching said first polysilicon film using said photoresist mask such that said first polysilicon film remains having a predetermined thickness over said trench region; forming a second gate oxide film over first polysilicon film-said over said trench region; and forming a second polysilicon film over the second gate oxide film, wherein said predetermined thickness of said first polysilicon film is between approximately 500 Å and
1000 Å
. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification