Devices with faraday cages and internal flexibility sipes

• US 8,125,796 B2
• Filed: 11/25/2008
• Issued: 02/28/2012
• Est. Priority Date: 11/21/2007
• Status: Active Grant

• Current Assignee: Frampton E. Ellis
• Original Assignee: Frampton E. Ellis
• Inventors: Ellis, Frampton E.
• Primary Examiner(s): Datskovskiy, Michail V
• Application Number:
  US12/292,769
• Publication Number:
  US 20090200661A1
• Time in Patent Office: 1,190 Days
• Field of Search: 361/600, 36167901-67926, 361715-724, 361/727, 361/732, 361/756, 361/816, 361/818, 361/831, 257/E21.521, 257/E21.524, 257/48, 257/620, 257/621, 257/682, 257/685, 257/686, 257/698, 257/203, 257/303, 257/213, 257/786, 257768-770, 257/773, 257/774, 438/6, 438106-118, 438130-132, 438/238, 438/455, 438/456, 312/223.2, 312/223.3, 312/236, 174/350, 174/387, 174/50, 174/50.54, 174/525
• US Class Current: 361/818
• CPC Class Codes: A43B 3/34 with electrical or electronic arrangements
• CPC Class Codes: G06F 1/16 Constructional details or arrangements
• CPC Class Codes: G06F 1/182 with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/60 Protection against electrostatic charges or discharges, e.g. Faraday shields
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H04L 63/02 for separating internal from external traffic, e.g. firewalls
• CPC Class Codes: H05K 9/0024 Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
• CPC Class Codes: H05K 9/0049 being metallic containers

Abstract

A computer or microchip comprising an outer chamber and at least one inner chamber inside the outer chamber. The outer chamber and the inner chamber being separated at least in part by an internal sipe, and at least a portion of a surface of the outer chamber forming at least a portion of a surface of the internal sipe. The internal sipe has opposing surfaces that are separate from each other and therefore can move relative to each other, and at least a portion of the opposing surfaces are in contact with each other in a unloaded condition. The outer chamber including a Faraday Cage. A computer, comprising an undiced semiconductor wafer having a multitude of microchips. The multitude of microchips on the wafer forming a plurality of independently functioning computers, each computer having independent communication capabilities.

Claims

1. A computer, comprising:

an undiced semiconductor wafer comprising a multitude of microchips,

each of the multitude of microchips including one or more core microprocessors configured to allow the microchip to function independently and including independent communication capabilities;

an outer chamber including a Faraday Cage;

at least one inner chamber inside said outer chamber;

said outer chamber and said inner chamber being separated at least in part by an internal sipe; and

wherein said internal sipe is formed by at least part of an inner surface of said outer chamber and at least part of an outer surface of said inner chamber which oppose each other and are separate from each other and therefore can move relative to each other; and

at least a portion of said opposing surface parts are in contact with each other in a unloaded condition.

2. The computer according to claim 1, wherein the independent communication capabilities include at least a wireless one of a radio or optical device.

3. The computer according to claim 1, wherein the independently functioning microchips include a microprocessor, a random access memory, a radio, and digital signal processor circuitry.

4. The computer according to claim 1, wherein incomplete microchips located around the periphery of the wafer, and microchips having a manufacturing defect or other damage, are deactivated or disconnected.

5. The computer according to claim 1, wherein the wafer has interconnects between the microchips.

6. The computer according to claim 1, wherein two or more wafers are stacked together.

7. The computer according to claim 1, wherein three or more wafers are stacked together.

8. The computer according to claim 1, wherein the undiced semiconductor wafer includes a curved outer portion.

9. The computer according to claim 1, wherein at least a portion of said surfaces forming said sipe are separated by a cooling media when unloaded.

10. The computer according to claim 1, further including a photovoltaic cell or fuel cell or battery or a combination of two or all three.

23. The computer according to claim 1, wherein the inner chamber includes the undiced semiconductor wafer.

11. A computer, comprising:

a plurality of undiced semiconductor wafers stacked together, each wafer having comprising a multitude of microchips,

the multitude of microchips each including one or more core microprocessors configured to allow the microchip to function independently and including independent communication capabilities;

an outer chamber including a Faraday Cage;

at least one inner chamber inside said outer chamber;

said outer chamber and said inner chamber being separated at least in part by an internal sipe; and

wherein said internal sipe is formed by at least part of an inner surface of said outer chamber and at least part of an outer surface of said inner chamber which oppose each other and are separate from each other and therefore can move relative to each other; and

at least a portion of said opposing surface parts are in contact with each other in a unloaded condition.

12. The computer according to claim 11, wherein at least one of the independently functioning microchips includes at least one functional component on two or more separate wafers.

13. The computer according to claim 12, wherein the functional components are located proximate to one another on the separate wafers.

14. The computer according to claim 12, where the functional components are located on three semiconductor wafers.

15. The computer according to claim 11, wherein incomplete microchips located around the periphery of the plurality of wafers, and microchips having a manufacturing defect or other damage, are deactivated or disconnected.

16. The computer according to claim 11, wherein the plurality of wafers have interconnects between the microchips.

17. The computer according to claim 11, wherein three or more wafers are stacked together.

18. The computer according to claim 11, wherein the independent communication capabilities include at least a wireless one of a radio or an optical device.

19. The computer according to claim 11, wherein the independently functioning computers include a microprocessor, a random access memory, a radio, and a digital signal processor.

20. The computer according to claim 11, wherein at least one of the plurality of undiced semiconductor wafers includes a curved outer portion.

21. The computer according to claim 11, wherein at least a portion of said surfaces forming said sipe are separated by a cooling media when unloaded.

22. The computer according to claim 11, further including a photovoltaic cell or fuel cell or battery or a combination of two or all three.

24. The computer according to claim 11, wherein the inner chamber includes the plurality of undiced semiconductor wafers.

25. A computer, comprising:

at least a section of an undiced semiconductor wafer comprising a multitude of microchips,

the multitude of microchips each including one or more core microprocessors configured to allow the microchip to function independently and including independent communication capabilities;

an outer chamber;

at least one inner chamber inside said outer chamber;

said outer chamber and said inner chamber being separated at least in part by an internal sipe; and

at least a portion of a surface of said outer chamber forming at least a portion of a surface of said internal sipe;

said internal sipe has opposing surfaces that are separate from each other and therefore can move relative to each other;

at least a portion of said opposing surfaces are in contact with each other in a unloaded condition; and

the outer chamber including a Faraday Cage.

26. The computer according to claim 25, wherein the section includes a part of a plurality of undiced semiconductor wafers stacked together, each wafer having a multitude of microchips.

27. The computer according to claim 25, wherein the independent communication capabilities include at least a wireless one of a radio or optical device.

28. The computer according to claim 25, wherein the independently functioning microchips include a microprocessor, a random access memory, a radio, and digital signal processor circuitry.

29. The computer according to claim 25, wherein incomplete microchips located around the periphery of the wafer, and microchips having a manufacturing defect or other damage, are deactivated or disconnected.

30. The computer according to claim 25, wherein the wafer has interconnects between the microchips.

31. The computer according to claim 25, wherein the section includes at least one half or at least one quarter of the wafer or wafers.

32. The computer according to claim 25, wherein three or more wafers are stacked together.

33. The computer according to claim 25, wherein the undiced semiconductor wafer includes a curved outer portion.

34. The computer according to claim 25, wherein at least a portion of said surfaces forming said sipe are separated by a cooling media when unloaded.

35. The computer according to claim 25, further including a photovoltaic cell or fuel cell or battery or a combination of two or all three.

36. The computer according to claim 25, wherein the section is non-rectangular.

37. The computer according to claim 25, wherein the inner chamber includes the section.