Chemical mechanical polishing with multi-zone slurry delivery

• US 8,128,461 B1
• Filed: 06/16/2008
• Issued: 03/06/2012
• Est. Priority Date: 06/16/2008
• Status: Active Grant

• Current Assignee: Novellus Systems Incorporated (Lam Research Corporation)
• Original Assignee: Novellus Systems Incorporated (Lam Research Corporation)
• Inventors: O'Moore, Fergal, Schultz, Steve
• Primary Examiner(s): Morgan, Eileen P.
• Application Number:
  US12/140,035
• Time in Patent Office: 1,359 Days
• Field of Search: 451/36, 451/41, 451/57, 451/59, 451/60, 451/285, 451/287, 451/446
• US Class Current: 451/41
• CPC Class Codes: B24B 37/12 Lapping plates for working plane surfaces
• CPC Class Codes: B24B 57/02 for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Abstract

Chemical-mechanical polishing or planarization (CMP) is enhanced with multi-zone slurry delivery. A polishing pad is provided that contacts with the work piece, and a multi-zone platen is displaced proximate to the polishing pad to facilitate slurry delivery. The platen includes multiple fluid distribution layers that each include a fluid-distributing channel extending from a fluid source to a distribution point on layer. The distribution points on each of the fluid distribution layers correspond to different locations on the polishing surface to thereby create multiple fluid-delivery zones on the pad.

Claims

1. A chemical-mechanical polishing apparatus for polishing a workpiece, the apparatus comprising:

a polishing pad having a polishing surface configured to engage the workpiece, wherein the polishing pad comprises a plurality of fluid delivery zones including a first fluid delivery zone and a second fluid delivery zone; and

a platen mechanically supporting the polishing pad from a side of the polishing pad opposite the polishing surface and providing fluid to each of the fluid delivery zones, wherein the platen comprises a common fluid source and a plurality of fluid distribution layers each arranged in parallel with the other fluid distribution layers and with the polishing pad, wherein the plurality of fluid distribution layers comprises;

a first fluid-distribution layer having a first fluid-distributing channel extending from the common fluid source to a first distribution point on the first fluid distribution layer that corresponds to the first fluid-delivery zone on the polishing pad; and

a second fluid-distribution layer located between the first fluid-distribution layer and the polishing pad, the second fluid-distribution layer having a second fluid-distributing channel extending from the common fluid source to a second distribution point on the second fluid distribution layer that corresponds to the second fluid delivery zone on the polishing pad that is different from the first fluid delivery zone, and wherein the second layer comprises at least one hole that allows fluid from the first distribution point on the first fluid-distribution layer to pass through the second fluid-distribution layer toward the first fluid delivery zone on the polishing pad.

2. The apparatus of claim 1 wherein the first and second fluid distribution layers are stacked with each other.

3. The apparatus of claim 1 further comprising a third fluid-distribution layer interposing the first and second fluid-distributing layers, wherein the third fluid-distribution layer has a third fluid-distributing channel extending from the common fluid source to a third distribution point on the third fluid distribution layer that corresponds to a third fluid delivery zone on the polishing pad that is different from the first and second fluid delivery zones, and wherein the third layer comprises a first hole that allows fluid from the first distribution point on the first fluid-distribution layer to pass through the third fluid-distribution layer toward the hole in the second fluid distribution layer toward the first fluid delivery zone on the polishing pad, and wherein the second layer comprises a second hole that allows fluid from the third distribution point on the third fluid distribution layer to pass through the second fluid-distribution layer toward the third distribution point on the polishing pad.

4. The apparatus of claim 1 wherein the common fluid source comprises a plug configured to be inserted into the platen.

5. The apparatus of claim 4 wherein the plug comprises a plurality of fluid distributing sections, wherein each of the plurality of sections comprises an orifice corresponding to the fluid-distributing channel of one of the fluid distribution layers.

6. The apparatus of claim 5 wherein each of the fluid distributing sections comprise an internal channel in fluid communication with the orifice.

7. The apparatus of claim 5 wherein the plug further comprises a plurality of fittings, each fitting having a central channel coupling the internal channel of one of the fluid distributing sections to one of a plurality of fluid delivery lines.

8. The apparatus of claim 7 further comprising a controller configured to adjust the fluid flow provided by each of the plurality of fluid delivery lines.

9. The apparatus of claim 1 wherein the platen further comprises an expansion layer displaced between the plurality of fluid-distribution layers and the polishing pad, wherein the expansion layer comprises a plurality of channel holes each corresponding to one of the distribution points of the fluid-distribution layers.

10. The apparatus of claim 8 wherein the expansion layer further comprises a plurality of expansion channels extending radially outward from each of the channel holes.

11. A platen for use in a chemical-mechanical polisher that polishes a work piece using a polishing pad having a plurality of fluid delivery zones including a first fluid delivery zone and a second fluid delivery zone, the platen comprising:

a first fluid distribution layer comprising a first channel radially extending from a first fluid source to a first distribution point corresponding to the first fluid delivery zone on the polishing pad;

a second fluid distribution layer proximate the first fluid distribution layer and configured to be located between the first fluid distribution layer and the polishing pad during operation, wherein the second fluid distribution layer comprises a second channel radially extending from a second fluid source to a second fluid distribution point that corresponds to the second fluid delivery zone on the polishing pad, wherein the second fluid distribution layer further comprises a hole configured to receive fluid from the first distribution point in the first fluid distribution layer; and

an expansion layer proximate the second fluid distribution layer and configured to be located between the second fluid distribution layer and the polishing pad on a side of the second fluid distribution layer opposite the first distribution layer, wherein the expansion layer comprises a first channel hole corresponding to the hole in the second fluid distribution layer and a second channel hole corresponding to the second fluid distribution point to thereby receive fluid provided by the first and second fluid distribution layers, respectively, and to distribute fluid to the first and second fluid delivery zones of the polishing pad, respectively, during operation of the platen.

12. The platen of claim 11, wherein the first and second fluid distribution layers are adapted to receive a plug that provides the first and second fluid sources.

13. The platen of claim 12 wherein the plug comprises a first layer configured to transmit fluid from a first fitting to the first fluid source and a second layer configured to transmit fluid from a second fitting to the second fluid source.

14. The platen of claim 11 wherein the expansion layer further comprises a plurality of expansion channels extending radially outward from each of the first and second channel holes.

15. A method of chemical-mechanical polishing of a work piece, the method comprising:

initiating chemical-mechanical polishing of the work piece using a chemical mechanical polisher comprising a polishing pad and a platen, wherein the polishing pad comprises a plurality of fluid delivery zones and the platen comprises a plurality of fluid distribution layers comprising at least a first fluid distribution layer and a second fluid distribution layer, wherein the second fluid distribution layer is located proximate the first delivery layer between the first fluid distribution layer and the polishing pad, wherein the first fluid distribution layer delivers fluid to a first one of the fluid delivery zones on the polishing pad and the second fluid distribution layer delivers fluid to a second one of the fluid delivery zones of the polishing pad, and wherein the second fluid distribution layer has a hole that allows fluid from the first distribution layer to flow through the second fluid distribution layer toward the first fluid delivery zone of the polishing pad;

providing fluid to the work piece via each of the plurality of fluid distribution layers from a common fluid source; and

for each of the plurality of fluid delivery zones, adjusting an amount of fluid provided to the fluid delivery zone by controlling the amount of fluid that is provided from the common fluid source to the layer of the platen that is associated with the fluid delivery zone, wherein the adjusting takes place during chemical-mechanical polishing of the work piece.

16. The method of claim 15 wherein the amount of fluid provided to each of the plurality of zones is adjusted independently of the amount of fluid provided to the other zones.

17. The method of claim 15 further comprising deactivating fluid delivery in at least one of the fluid delivery zones while continuing fluid delivery in at least another one of the fluid delivery zones.

18. The method of claim 15 wherein the amount of fluid provided via at least one of the plurality of zones is adjusted in response to data received from a probe.

19. The method of claim 15 wherein the amount of fluid provided via at least one of the plurality of zones is adjusted in conjunction with an applied pressure.

20. The method of claim 15 further comprising adjusting a pressure applied to at least one of the plurality of fluid delivery zones during chemical-mechanical polishing of the work piece.