Chemical mechanical polishing with multi-zone slurry delivery
First Claim
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1. A chemical-mechanical polishing apparatus for polishing a workpiece, the apparatus comprising:
- a polishing pad having a polishing surface configured to engage the workpiece, wherein the polishing pad comprises a plurality of fluid delivery zones including a first fluid delivery zone and a second fluid delivery zone; and
a platen mechanically supporting the polishing pad from a side of the polishing pad opposite the polishing surface and providing fluid to each of the fluid delivery zones, wherein the platen comprises a common fluid source and a plurality of fluid distribution layers each arranged in parallel with the other fluid distribution layers and with the polishing pad, wherein the plurality of fluid distribution layers comprises;
a first fluid-distribution layer having a first fluid-distributing channel extending from the common fluid source to a first distribution point on the first fluid distribution layer that corresponds to the first fluid-delivery zone on the polishing pad; and
a second fluid-distribution layer located between the first fluid-distribution layer and the polishing pad, the second fluid-distribution layer having a second fluid-distributing channel extending from the common fluid source to a second distribution point on the second fluid distribution layer that corresponds to the second fluid delivery zone on the polishing pad that is different from the first fluid delivery zone, and wherein the second layer comprises at least one hole that allows fluid from the first distribution point on the first fluid-distribution layer to pass through the second fluid-distribution layer toward the first fluid delivery zone on the polishing pad.
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Abstract
Chemical-mechanical polishing or planarization (CMP) is enhanced with multi-zone slurry delivery. A polishing pad is provided that contacts with the work piece, and a multi-zone platen is displaced proximate to the polishing pad to facilitate slurry delivery. The platen includes multiple fluid distribution layers that each include a fluid-distributing channel extending from a fluid source to a distribution point on layer. The distribution points on each of the fluid distribution layers correspond to different locations on the polishing surface to thereby create multiple fluid-delivery zones on the pad.
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Citations
20 Claims
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1. A chemical-mechanical polishing apparatus for polishing a workpiece, the apparatus comprising:
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a polishing pad having a polishing surface configured to engage the workpiece, wherein the polishing pad comprises a plurality of fluid delivery zones including a first fluid delivery zone and a second fluid delivery zone; and a platen mechanically supporting the polishing pad from a side of the polishing pad opposite the polishing surface and providing fluid to each of the fluid delivery zones, wherein the platen comprises a common fluid source and a plurality of fluid distribution layers each arranged in parallel with the other fluid distribution layers and with the polishing pad, wherein the plurality of fluid distribution layers comprises; a first fluid-distribution layer having a first fluid-distributing channel extending from the common fluid source to a first distribution point on the first fluid distribution layer that corresponds to the first fluid-delivery zone on the polishing pad; and a second fluid-distribution layer located between the first fluid-distribution layer and the polishing pad, the second fluid-distribution layer having a second fluid-distributing channel extending from the common fluid source to a second distribution point on the second fluid distribution layer that corresponds to the second fluid delivery zone on the polishing pad that is different from the first fluid delivery zone, and wherein the second layer comprises at least one hole that allows fluid from the first distribution point on the first fluid-distribution layer to pass through the second fluid-distribution layer toward the first fluid delivery zone on the polishing pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A platen for use in a chemical-mechanical polisher that polishes a work piece using a polishing pad having a plurality of fluid delivery zones including a first fluid delivery zone and a second fluid delivery zone, the platen comprising:
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a first fluid distribution layer comprising a first channel radially extending from a first fluid source to a first distribution point corresponding to the first fluid delivery zone on the polishing pad; a second fluid distribution layer proximate the first fluid distribution layer and configured to be located between the first fluid distribution layer and the polishing pad during operation, wherein the second fluid distribution layer comprises a second channel radially extending from a second fluid source to a second fluid distribution point that corresponds to the second fluid delivery zone on the polishing pad, wherein the second fluid distribution layer further comprises a hole configured to receive fluid from the first distribution point in the first fluid distribution layer; and an expansion layer proximate the second fluid distribution layer and configured to be located between the second fluid distribution layer and the polishing pad on a side of the second fluid distribution layer opposite the first distribution layer, wherein the expansion layer comprises a first channel hole corresponding to the hole in the second fluid distribution layer and a second channel hole corresponding to the second fluid distribution point to thereby receive fluid provided by the first and second fluid distribution layers, respectively, and to distribute fluid to the first and second fluid delivery zones of the polishing pad, respectively, during operation of the platen. - View Dependent Claims (12, 13, 14)
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15. A method of chemical-mechanical polishing of a work piece, the method comprising:
initiating chemical-mechanical polishing of the work piece using a chemical mechanical polisher comprising a polishing pad and a platen, wherein the polishing pad comprises a plurality of fluid delivery zones and the platen comprises a plurality of fluid distribution layers comprising at least a first fluid distribution layer and a second fluid distribution layer, wherein the second fluid distribution layer is located proximate the first delivery layer between the first fluid distribution layer and the polishing pad, wherein the first fluid distribution layer delivers fluid to a first one of the fluid delivery zones on the polishing pad and the second fluid distribution layer delivers fluid to a second one of the fluid delivery zones of the polishing pad, and wherein the second fluid distribution layer has a hole that allows fluid from the first distribution layer to flow through the second fluid distribution layer toward the first fluid delivery zone of the polishing pad; providing fluid to the work piece via each of the plurality of fluid distribution layers from a common fluid source; and for each of the plurality of fluid delivery zones, adjusting an amount of fluid provided to the fluid delivery zone by controlling the amount of fluid that is provided from the common fluid source to the layer of the platen that is associated with the fluid delivery zone, wherein the adjusting takes place during chemical-mechanical polishing of the work piece. - View Dependent Claims (16, 17, 18, 19, 20)
Specification