Pressure-sensitive adhesive and detachable strip formed from it
First Claim
1. A method of forming and releasing an adhesive bond, said method comprising adhering a pressure-sensitive adhesive strip to a substrate to form an adhesive bond, and thereafter releasing the adhesive bond by stretching the adhesive strip substantially in the plane of said adhesive bond, wherein the adhesive strip comprises a pressure-sensitive adhesive composed at least of:
- a vinylaromatic block copolymer;
a solid tackifying resin having a softening temperature by the ring-and-ball method of more than 30°
C.; and
a resin which is liquid at room temperature (23°
C.);
the fraction of liquid resin accounting for at least 40% by weight, based on a total weight of resin.
3 Assignments
0 Petitions
Accused Products
Abstract
Pressure-sensitive adhesive for single- or double-sidedly tacky pressure-sensitive adhesive strips redetachable without residue or destruction both by extensive stretching substantially in the bond plane and by peeling, the pressure-sensitive adhesive being composed at least of (1) a vinylaromatic block copolymer, (2) a solid tackifying resin having a softening temperature by the ring-and-ball method of more than 30° C. and (3) a resin which is liquid at room temperature (23° C.), the fraction of liquid resin accounting for at least 40% by weight, based on the total amount of resin. Strips formed from the adhesive and the use of the strips to form redetachable bonds are also disclosed.
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Citations
8 Claims
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1. A method of forming and releasing an adhesive bond, said method comprising adhering a pressure-sensitive adhesive strip to a substrate to form an adhesive bond, and thereafter releasing the adhesive bond by stretching the adhesive strip substantially in the plane of said adhesive bond, wherein the adhesive strip comprises a pressure-sensitive adhesive composed at least of:
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a vinylaromatic block copolymer; a solid tackifying resin having a softening temperature by the ring-and-ball method of more than 30°
C.; anda resin which is liquid at room temperature (23°
C.);the fraction of liquid resin accounting for at least 40% by weight, based on a total weight of resin. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification