Discrete stress isolator attachment structures for MEMS sensor packages
First Claim
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1. A Micro Electro-Mechanical System (MEMS) sensor device, comprising:
- a package substrate;
a mechanism die spaced away from the package substrate;
a mechanism device depending from the mechanism die between the mechanism die and the package substrate; and
one or more discrete isolation structures interposed between the mechanism die and the package substrate, the one or more discrete isolation structures attaching the mechanism die to the package substrate,wherein the isolation structures and the mechanism device are composed of substantially the same semiconducting material,wherein at least one of the isolation structures further comprises mutually isolated first and second portions spaced apart on opposite sides of a gap, the first and second portions linked by one or more flexures,wherein the mechanism die is attached only to the first portion of the isolation structures.
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Abstract
A discrete stress isolation apparatus for a Micro Electro-Mechanical System (MEMS) inertial sensor device having a mechanism die and a package. A capacitive device mechanism is formed in a substrate layer positioned between the mechanism die and package substrate. A discrete stress isolation structure is formed in the same substrate layer with but physically separated from the capacitive device mechanism. The discrete stress isolation structure is interposed between the mechanism die and the package substrate and provides the mechanical and electrical attachment therebetween.
37 Citations
11 Claims
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1. A Micro Electro-Mechanical System (MEMS) sensor device, comprising:
- a package substrate;
a mechanism die spaced away from the package substrate; a mechanism device depending from the mechanism die between the mechanism die and the package substrate; and one or more discrete isolation structures interposed between the mechanism die and the package substrate, the one or more discrete isolation structures attaching the mechanism die to the package substrate, wherein the isolation structures and the mechanism device are composed of substantially the same semiconducting material, wherein at least one of the isolation structures further comprises mutually isolated first and second portions spaced apart on opposite sides of a gap, the first and second portions linked by one or more flexures, wherein the mechanism die is attached only to the first portion of the isolation structures. - View Dependent Claims (2, 3, 4, 5)
- a package substrate;
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6. A Micro Electro-Mechanical System (MEMS) sensor device, comprising:
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a package substrate having a plurality of electrical interface pads on a surface thereof; a base wafer having a relatively thicker first substrate layer and a relatively thinner second substrate layer; a mechanism die formed in the first substrate layer of the base wafer; a mechanism device formed in the second substrate layer of the base wafer and depending from the mechanism die through one or more anchors; and a plurality of discrete stress isolation structures formed from the second substrate layer of the base wafer independent of the mechanism device and depending from the mechanism die through one or more anchors, the isolation structures being attached to the electrical interface pads on the surface of the package substrate, wherein one or more of the discrete stress isolation structures further comprises; a first portion attached to the mechanism die through the one or more anchors, and a second portion attached to the electrical interface pads on the surface of the package substrate, the first and second portions spaced apart on opposite sides of a gap, and the first and second portions linked by one or more flexures. - View Dependent Claims (7, 8, 9, 10, 11)
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Specification