Housed active microstructures with direct contacting to a substrate
First Claim
Patent Images
1. A microstructured component with microsensors or other active microcomponents, comprising:
- a substrate comprising electrical conductor tracks and at least one housing arranged on the substrate;
at least two active structures accommodated within a single cavity of the at least one housing and at least a first one of the at least two active structures being applied on a cover element of the at least one housing, whereas at least a second one of the at least two active structures is applied on a bottom element of the at least one housing;
at least one of the active microstructures being electrically contacted through an enclosing of the at least one housing with one of the electrical conductor tracks of the substrate;
wherein the cover element having a surface facing the interior of the at least one housing that carries at least one electrical contact site which is in conducting contact with the at least one active microstructures applied on the cover element or designed integral with the cover element, and wherein the at least one electrical contact site is a raised structure connected electrically conducting to raised structure situated on a surface of the bottom element facing the inside of the at least one housing and being an electrical contact site, which, in turn, is electrically contacted to one of the electrical conductor tracks of the substrate through the at least one enclosing housing, wherein the raised structures have a distance to the side wall of the component.
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Abstract
A microstructured component with microsensors or other active microcomponent is provided. The microstructured component includes a substrate and at least one housing arranged on the substrate with one or more active microstructures situated on it.
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Citations
35 Claims
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1. A microstructured component with microsensors or other active microcomponents, comprising:
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a substrate comprising electrical conductor tracks and at least one housing arranged on the substrate; at least two active structures accommodated within a single cavity of the at least one housing and at least a first one of the at least two active structures being applied on a cover element of the at least one housing, whereas at least a second one of the at least two active structures is applied on a bottom element of the at least one housing; at least one of the active microstructures being electrically contacted through an enclosing of the at least one housing with one of the electrical conductor tracks of the substrate; wherein the cover element having a surface facing the interior of the at least one housing that carries at least one electrical contact site which is in conducting contact with the at least one active microstructures applied on the cover element or designed integral with the cover element, and wherein the at least one electrical contact site is a raised structure connected electrically conducting to raised structure situated on a surface of the bottom element facing the inside of the at least one housing and being an electrical contact site, which, in turn, is electrically contacted to one of the electrical conductor tracks of the substrate through the at least one enclosing housing, wherein the raised structures have a distance to the side wall of the component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
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30. A microstructured component with microsensors or other active microcomponents, comprising:
- a substrate, which is provided with electrical conductor tracks and at least one housing arranged on the substrate, the housing being formed from a cover element and a bottom element, which are connected via a sealing frame determining the spacing between the surfaces of the bottom and cover element, wherein at least two active structures are accommodated within a single cavity of the at least one housing, at least a first one of the two active structures being applied on the cover element of the housing, whereas at least a second one of the two active structures is applied on the bottom element of the housing, at least one of the active microstructures being contacted through the enclosing housing electrically with one of the electrical conductor tracks of the substrate, wherein the cover element, on its surface facing the interior of the housing, carries at least one electrical contact site which is in conducting contact with the active structure applied on the cover element or designed integral with the cover element, and in which the at least one electrical contact site is a raised structure which is electrically conducting connected via electrical contacts within the at least one housing to an electrical contact site in the form of a raised structure situated on the surface of the bottom element facing the inside of the housing, which, in turn, is contacted to one of the electrical conductor tracks of the substrate through the enclosing housing electrically, wherein the raised structures have a distance to the side wall of the component.
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31. A microstructured component with microsensors or other active microcomponents, comprising:
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a substrate comprising electrical conductor tracks and at least one housing arranged on the substrate; at least two active structures are accommodated within a single cavity of the at least one housing and at least a first one of the at least two active structures being applied on a cover element of the at least one housing, whereas at least a second one of the at least two active structures is applied on a bottom element of the at least one housing; at least one of the active microstructures being electrically contacted through an enclosing of the at least one housing with one of the electrical conductor tracks of the substrate; wherein the cover element having a surface facing the interior of the at least one housing that carries at least one electrical contact site which is in conducting contact with the at least one active microstructures applied on the cover element or designed integral with the cover element, and wherein the at least one electrical contact site is a raised structure connected electrically conducting to a raised structure situated on a surface of the bottom element facing the inside of the at least one housing being an electrical contact site, which, in turn, is electrically contacted to one of the electrical conductor tracks of the substrate through the enclosing of the at least one housing, wherein the raised structures are bumps.
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32. A microstructured component with microsensors or other active microcomponents, comprising:
- a substrate, which is provided with electrical conductor tracks and at least one housing arranged on the substrate, the housing being formed from a cover element and a bottom element, which are connected via a sealing frame determining the spacing between the surfaces of the bottom and cover element, wherein at least two active structures are accommodated within a single cavity of the at least one housing, at least a first one of the two active structures being applied on the cover element of the housing, whereas at least a second one of the two active structures is applied on the bottom element of the housing, at least one of the active microstructures being contacted through the enclosing housing electrically with one of the electrical conductor tracks of the substrate, wherein the cover element, on its surface facing the interior of the housing, carries at least one electrical contact site which is in conducting contact with the active structure applied on the cover element or designed integral with the cover element, and in which the at least one electrical contact site is a raised structure which is electrically conducting connected via electrical contacts within the at least one housing to an electrical contact site in the form of a raised structure situated on the surface of the bottom element facing the inside of the housing, which, in turn, is contacted to one of the electrical conductor tracks of the substrate through the enclosing housing electrically, wherein the raised structures are bumps.
- View Dependent Claims (33, 34, 35)
Specification