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Semiconductor device and method of forming interconnect structure in non-active area of wafer

  • US 8,129,845 B2
  • Filed: 09/09/2008
  • Issued: 03/06/2012
  • Est. Priority Date: 09/25/2007
  • Status: Active Grant
First Claim
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1. A method of making a semiconductor device, comprising:

  • providing a semiconductor wafer having a plurality of semiconductor die;

    forming contact pads in an active area of the semiconductor die and in a non-active area of the semiconductor wafer between the semiconductor die;

    forming conductive bumps on the contact pads in the active area of the semiconductor die and in the non-active area of the semiconductor wafer between the semiconductor die;

    forming an encapsulant over the conductive bumps;

    singulating the semiconductor wafer to separate the semiconductor die; and

    mounting the semiconductor die to a package substrate.

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