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Sensor element placement for package stress compensation

  • US 8,132,465 B1
  • Filed: 07/31/2008
  • Issued: 03/13/2012
  • Est. Priority Date: 08/01/2007
  • Status: Active Grant
First Claim
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1. A pressure sensor comprising:

  • a silicon diaphragm;

    a frame of thicker bulk silicon physically supporting the diaphragm;

    a first sensing element located in the bulk; and

    a second sensing element located in the diaphragm,wherein the first sensing element and the second sensing element each comprise a single transistor having a single gate and more than four source-drain regions.

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