Method for producing organic thin film by using film physical property improving process
First Claim
1. A method for producing an organic thin film for forming an organic thin film on a substrate surface, comprising at least a step (B) of allowing the substrate to contact with an organic solvent solution comprising a metal surfactant having at least one or more hydrolysable group or hydroxyl group, and a catalyst that can interact with the metal surfactant, wherein the method further comprises after the step B, a step (E1) of heating the substrate which has been in contact with the organic solvent solution at 100°
- C. to 150°
C.;
a step (E2) of immersing the substrate which has been in contact with the organic solvent solution in a warm water of 40°
C. or more and less than the boiling point;
or a step (E3) of allowing the substrate which has been in contact with the organic solvent solution to contact with a moisture vapor of 60°
C. to 150°
C.
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Accused Products
Abstract
A method is provided for producing an organic thin film on a substrate surface comprising improved heat resistance or durability; said method comprising at least a step (B) of allowing the substrate to contact with an organic solvent solution comprising a metal surfactant having at least one or more hydrolysable group or hydroxyl group, and a catalyst that can interact with the metal surfactant, wherein the method further comprises after step (B), step (E1) of heating the substrate which has been in contact with the organic solvent solution at 100° C. to 150° C.; step (E2) of immersing the substrate which has been in contact with the organic solvent solution in a warm water of 40° C. or more and less than the boiling point; or step (E3) of allowing the substrate which has been in contact with the organic solvent solution to contact with a moisture vapor of 60° C. to 150° C.
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Citations
24 Claims
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1. A method for producing an organic thin film for forming an organic thin film on a substrate surface, comprising at least a step (B) of allowing the substrate to contact with an organic solvent solution comprising a metal surfactant having at least one or more hydrolysable group or hydroxyl group, and a catalyst that can interact with the metal surfactant, wherein the method further comprises after the step B, a step (E1) of heating the substrate which has been in contact with the organic solvent solution at 100°
- C. to 150°
C.;
a step (E2) of immersing the substrate which has been in contact with the organic solvent solution in a warm water of 40°
C. or more and less than the boiling point;
or a step (E3) of allowing the substrate which has been in contact with the organic solvent solution to contact with a moisture vapor of 60°
C. to 150°
C. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
- C. to 150°
Specification