Method of manufacturing a coordinate detector

• US 8,133,660 B2
• Filed: 05/11/2009
• Issued: 03/13/2012
• Est. Priority Date: 05/15/2008
• Status: Active Grant

• Current Assignee: Fujitsu Component Limited (Fujitsu Limited)
• Original Assignee: Fujitsu Component Limited (Fujitsu Limited)
• Inventors: Kondoh, Koichi
• Primary Examiner(s): WU, SHEAN CHIU
• Application Number:
  US12/463,468
• Publication Number:
  US 20090286186A1
• Time in Patent Office: 1,037 Days
• Field of Search: 430/311, 430/313
• US Class Current: 430/311
• CPC Class Codes: G06F 3/045 using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact

Abstract

A method of manufacturing a coordinate detector having a resistive film and a common electrode for applying a voltage to the resistive film is disclosed that includes the steps of (a) applying a photoresist onto the resistive film formed on a substrate formed of an insulator; (b) forming a resist pattern on the resistive film by exposing the applied photoresist to light through a predetermined mask and subsequently developing the applied photoresist; (c) forming a resistive film removal region by removing a portion of the resistive film without the resist pattern; (d) removing the resist pattern after step (c); and (e) forming the common electrode over the resistive film removal region after step (d).

Claims

1. A method of manufacturing a coordinate detector having a resistive film and a common electrode for applying a voltage to the resistive film, the method comprising the steps of

(a) applying a photoresist onto the resistive film formed on a substrate formed of an insulator;

(b) forming a resist pattern on the resistive film by exposing the applied photoresist to light through a predetermined mask and subsequently developing the applied photoresist;

(c) forming a resistive film removal region by removing a portion of the resistive film without the resist pattern;

(d) removing the resist pattern after said step (c); and

(e) forming the common electrode over the resistive film removal region after said step (d).

2. The method as claimed in claim 1, wherein said step (c) removes the portion of the resistive film by one of wet etching using an acid and dry etching.

3. The method as claimed in claim 1, wherein the resistive film removal region includes a first part in a periphery thereof, formed by removing the portion of the resistive film without the resist pattern, and a second part formed of the resistive film remaining inside the first part, and

the first part and the second part are electrically insulated.

4. A method of manufacturing a coordinate detector having a resistive film and a common electrode for applying a voltage to the resistive film, the method comprising the steps of:

(a) applying a photoresist onto the resistive film formed on a substrate formed of an insulator;

(b) forming a resist pattern on the resistive film by exposing the applied photoresist to light through a predetermined mask and subsequently developing the applied photoresist; and

(c) forming a resistive film removal region by removing a portion of the resistive film without the resist pattern,

wherein the common electrode is formed between a peripheral edge of the resistive film and the resistive film removal region so that a distance between adjacent sides of the common electrode and the resistive film removal region is more than or equal to 0 mm and less than or equal to 5 mm.

5. The method as claimed in claim 4, wherein said step (c) removes the portion of the resistive film by one of wet etching using an acid and dry etching.

6. The method as claimed in claim 4, wherein the resistive film removal region includes a first part in a periphery thereof, formed by removing the portion of the resistive film without the resist pattern, and a second part formed of the resistive film remaining inside the first part, and

the first part and the second part are electrically insulated.