Wired circuit board

• US 8,134,080 B2
• Filed: 06/30/2006
• Issued: 03/13/2012
• Est. Priority Date: 07/07/2005
• Status: Active Grant

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: Ishii, Jun, Ohwaki, Yasuhito, Funada, Yasuhito
• Primary Examiner(s): Im, Junghwa M
• Application Number:
  US11/477,935
• Publication Number:
  US 20070017695A1
• Time in Patent Office: 2,083 Days
• Field of Search: 257/758, 174/255, 174/256, 174/257
• US Class Current: 174/255
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 2201/0379 Stacked conductors
• CPC Class Codes: H05K 2201/0969 Apertured conductors
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 2201/2072 Anchoring, i.e. one structure gripping into another
• CPC Class Codes: H05K 2203/0323 Working metal substrate or core, e.g. by etching, deforming
• CPC Class Codes: H05K 3/06 the conductive material being removed chemically or electrolytically, e.g. by photo-etch process semi-additive methods H05K3/108
• CPC Class Codes: H05K 3/205 using a pattern electroplated or electroformed on a metallic carrier
• CPC Class Codes: H05K 3/38 Improvement of the adhesion between the insulating substrate and the metal
• CPC Class Codes: H05K 3/44 Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits H05K3/0058, H05K3/4608, and H05K3/4641 take precedence

Abstract

A wired circuit board that can provide an enhanced adhesion of a metal supporting board at a marginal portion of an opening formed in the metal supporting board with a simple structure to prevent stripping of the metal supporting board. In a suspension board with circuit, in order to reduce a transmission loss of a conductive pattern, a metal foil embedded in an insulating base layer is formed in a pattern comprising a first metal foil portion and a second metal foil portion surrounding the first metal foil portion spaced apart therefrom, and an opening is formed in the metal supporting board so that a marginal portion of the opening is located in a space between the first metal foil portion and the second metal foil portion.

Claims

1. A wired circuit board comprising:

a metal supporting board;

an insulating layer made of resin and formed on the metal supporting board;

a conductive pattern formed on the insulating layer; and

a metal foil embedded in the insulating layer such that the metal foil is separated from the conductive pattern by the insulating layer and the conductive pattern is opposed to the metal foil, wherein an opening confronting at least a part of the conductive pattern is formed in and surrounded by the metal supporting board, wherein at least a part of the metal foil is placed in the opening and exposed from the insulating layer not to overlap with a marginal portion of the opening such that a gap is formed between a peripheral edge of the part of the metal foil placed in the opening and the opening in the metal supporting board, wherein the gap surrounds the part of the metal foil placed in the opening, wherein at least a part of the marginal portion of the opening of the metal supporting board is put in direct contact with the insulating layer such that an enhanced adhesion between the metal supporting board and the insulating layer is provided at the marginal portion of the opening, and wherein the opening having the part of the metal foil placed therein is operative to adjust a characteristic impedance of the conductive pattern and reduce transmission loss of the conductive pattern.

2. The wired circuit board according to claim 1, wherein the metal foil comprises:

a first metal foil portion embedded in the insulating layer and placed in the opening, and

a second metal foil portion embedded in the insulating layer and which is spaced apart from the first metal foil portion so that a contact portion of the marginal portion of the opening of the metal supporting board with the insulating layer is located between the first metal foil portion and the second metal foil portion to confront the metal supporting board.

3. The wired circuit board according to claim 2, wherein a thin metal film is interposed between the metal supporting board and the second metal foil portion.

4. The wired circuit board according to claim 1, wherein the metal supporting board is formed of stainless steel, wherein the metal foil is formed of copper or a copper alloy, and wherein the insulating layer is formed of polyimide.

5. The wired circuit board according to claim 1, wherein the wired circuit board comprises a suspension board with circuit.