Seal for light emitting display device, method, and apparatus

• US 8,134,293 B2
• Filed: 08/17/2010
• Issued: 03/13/2012
• Est. Priority Date: 11/07/2006
• Status: Active Grant

• Current Assignee: Corning Incorporated
• Original Assignee: Corning Incorporated
• Inventors: Logunov, Stephan Lvovich, Reddy, Kamjula Pattabhirami, Widjaja, Sujanto
• Primary Examiner(s): Santiago, Mariceli
• Application Number:
  US12/857,984
• Publication Number:
  US 20110001424A1
• Time in Patent Office: 574 Days
• Field of Search: 313498-512, 445/24, 445/25
• US Class Current: 313/512
• CPC Class Codes: B32B 17/06 comprising glass as the main or only constituent of a layer, next to another layer of a specific material
• CPC Class Codes: C03C 27/06 Joining glass to glass by processes other than fusing fusing C03B23/20; units for use as elements for closing wall or like openings and comprising two or more parallel glass panes in spaced relationship, the panes being permanently secured together E06B3/66
• CPC Class Codes: C03C 27/10 with the aid of adhesive specially adapted for that purpose
• CPC Class Codes: C03C 3/066 containing zinc
• CPC Class Codes: C03C 3/091 containing aluminium
• CPC Class Codes: C03C 3/093 containing zinc or zirconium
• CPC Class Codes: C03C 3/21 containing titanium, zirconium, vanadium, tungsten or molybdenum
• CPC Class Codes: C03C 8/04 containing zinc
• CPC Class Codes: C03C 8/08 containing phosphorus
• CPC Class Codes: C03C 8/24 Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants

Abstract

A glass package is disclosed comprising a first substrate and a second substrate, where the substrates are attached in at least two locations, at least one attachment comprising a frit, and at least one attachment comprising a polymeric adhesive and wherein the frit comprises a glass portion comprising: a base component comprising and at least one absorbing component. Also disclosed is a method of sealing a light emitting display device comprising providing a light emitting layer, a first substrate and a second substrate, where a frit is deposited between the substrates and a polymeric adhesive is deposited either between the substrates or around the edge of the device, and where the frit is sealed with a radiation source and the polymeric adhesive is cured.

Claims

1. A glass package comprising:

a first substrate,

a second substrate,

a sealed frit coupling the first substrate and the second substrate, and

a polymeric adhesive further coupling the first substrate and the second substrate,

wherein at least a portion of the first substrate is in overlying registration to at least a portion of the second substrate; and

wherein the frit is made from glass doped with at least one transition metal and the frit does not comprise a coefficient of thermal expansion matching filler and an unsealed frit is disposed between the sealed frit and the polymeric adhesive.

2. The glass package of claim 1, wherein the sealed frit forms a sealed frit loop.

3. The glass package of claim 2, wherein the polymeric adhesive forms an adhesive loop positioned outside of the sealed frit loop.

4. The glass package of claim 1, wherein the polymeric adhesive is positioned in at least two discrete locations.

5. The glass package of claim 1, wherein the first substrate and/or the second substrate comprise corners, and wherein the polymeric adhesive is positioned at the corners.

6. The glass package of claim 1, further comprising a light emitting layer, wherein the sealed frit is positioned between the first and second substrates to form a sealed frit loop, and the light emitting layer is positioned between the first and second substrates and within the sealed frit loop.

7. The glass package of claim 6, wherein the light emitting layer comprises an organic light emitting diode.

8. The glass package of claim 1, wherein the polymeric adhesive comprises an epoxy.

9. The glass package of claim 1, wherein the first substrate and/or the second substrate comprise a borosilicate glass.

10. The glass package of claim 1, wherein the sealed frit is a hermetic seal between the first substrate and the second substrate.

11. A method of sealing a light emitting display device comprising:

providing a light emitting layer, a first substrate and a second substrate, each substrate having an inner surface and an outer surface;

depositing a frit around the perimeter of the inner surface of the first substrate;

depositing a polymeric adhesive on the inner surface of at least one of the first or second substrate;

joining the inner surfaces of the first substrate and the second substrate so that the light emitting layer is positioned between the first and second substrates, and so that at least a portion of the first substrate is in overlying registration with at least a portion of the second substrate;

heating a first portion of the frit such that the first portion of the frit forms a hermetic seal between the first substrate and the second substrate and wherein a second portion of the frit is unsealed; and

curing the polymer adhesive;

wherein the heating and curing steps may be performed in any order.

12. The method of claim 11, wherein the heating step comprises a laser.

13. A method of sealing a light emitting display device comprising:

providing a light emitting layer, a first substrate and a second substrate, each substrate having an inner surface and an outer surface;

depositing a frit around the perimeter of the inner surface of the first substrate;

joining the inner surfaces of the first substrate and the second substrate so that at least a portion of the first substrate is in overlying registration with at least a portion of the second substrate and so that the light emitting layer is positioned between the first and second substrate, thereby creating a joined first and second substrate;

depositing a polymeric adhesive around the perimeter of the joined first and second substrates;

heating a first portion of the frit such that the first portion of the frit forms a hermetic seal between the first substrate and the second substrate and wherein a second portion of the frit is unsealed; and

curing the polymer adhesive;

wherein the heating and curing steps may he performed in any order.