Method and system for filters embedded in an integrated circuit package
First Claim
1. A method for enabling communication, the method comprising:
- controlling filtering of signals within an integrated circuit via one or more filter components embedded within a multi-layer package of said integrated circuit, wherein;
said one or more filter components are electrically coupled to one or more switchable arrays of capacitors within said integrated circuit; and
said filter components comprise a plurality of resonator sections, and each one of said plurality of resonator sections is coupled to each other one of said plurality of resonator sections via one of a plurality of programmable impedances.
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Accused Products
Abstract
Methods and systems for filters embedded in an integrated circuit package are disclosed and may include controlling filtering of signals within an integrated circuit via one or more filter components embedded within a multi-layer package bonded to the integrated circuit. The one or more filter components may be electrically coupled to one or more switchable capacitors within the integrated circuit. The filter components may include transmission line devices, microstrip filters, transformers, surface mount devices, inductors, and/or coplanar waveguide filters. The filter components may be fabricated utilizing metal conductive layers and/or ferromagnetic layers deposited on and/or embedded within the multi-layer package. The integrated circuit may be electrically coupled to the multi-layer package utilizing a flip-chip bonding technique.
53 Citations
22 Claims
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1. A method for enabling communication, the method comprising:
controlling filtering of signals within an integrated circuit via one or more filter components embedded within a multi-layer package of said integrated circuit, wherein; said one or more filter components are electrically coupled to one or more switchable arrays of capacitors within said integrated circuit; and said filter components comprise a plurality of resonator sections, and each one of said plurality of resonator sections is coupled to each other one of said plurality of resonator sections via one of a plurality of programmable impedances. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A system for enabling communication, the system comprising:
a multi-layer package comprising one or more filter components, wherein; said one or more filter components are electrically coupled to one or more switchable arrays of capacitors in an integrated circuit; said multilayer package is bonded to said integrated circuit; said multi-layer package and/or said integrated circuit enables filtering of signals; and said filter components comprises a plurality of resonator sections, and each one of said plurality of resonator sections is coupled to each other one of said plurality of resonator sections via one of a plurality of programmable impedances. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
Specification