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Electronic component mounter and mounting method

  • US 8,136,219 B2
  • Filed: 07/31/2006
  • Issued: 03/20/2012
  • Est. Priority Date: 08/02/2005
  • Status: Active Grant
First Claim
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1. A component height measurement method applied to a mounter equipped with a transfer head having a component-sucking-and-holding nozzle, for transferring a component and mounting the component onto a board, said method comprising:

  • tentatively lowering the nozzle and the component sucked and held by the nozzle, and tentatively measuring a height of the component using an amount of said tentative lowering of the nozzle and a signal outputted from a line sensor for measuring the height of the component, the line sensor being disposed laterally relative to the nozzle and extending vertically along a direction of movement of the nozzle;

    lowering the component to within a high-accuracy range of the line sensor, based on the height of the component measured in said tentative measuring; and

    definitively measuring the height of the component using the line sensor.

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