Heat transport apparatus and heat transport apparatus manufacturing method

• US 8,136,581 B2
• Filed: 12/04/2003
• Issued: 03/20/2012
• Est. Priority Date: 12/12/2002
• Status: Expired due to Fees

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Tonosaki, Minehiro, Kato, Eisaku, Yajima, Masakazu, Yajima, Takashi
• Primary Examiner(s): Leo, Leonard R
• Application Number:
  US10/538,296
• Publication Number:
  US 20060065385A1
• Time in Patent Office: 3,029 Days
• Field of Search: 165/104.21, 165/104.26, 165/104.33, 165/135, 361/700, 298/900.32
• US Class Current: 165/104.26
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/043 forming loops, e.g. capillary pumped loops
• CPC Class Codes: Y10T 29/49353 Heat pipe device making

Abstract

A heat transport device having a composite structure that is readily manufactured and a method for manufacturing such a heat transport device are provided. The heat transport device includes a first base plate having a liquid suction and retention unit for sucking and retaining a liquid-phase working fluid by capillary force; a second base plate having a face provided with a first concavity functioning as a vaporization chamber for vaporizing the working fluid, a second concavity functioning as a liquefaction chamber for liquefying the working fluid, a first ditch for transporting the vaporized working fluid, a second ditch for transporting the liquefied working fluid, the second base plate comprising a material having a thermal conductivity lower than that of silicon; and a thermoplastic or thermosetting resin material for bonding the first and second base plates. The heat transport device can be readily manufactured by heating the first and second base plates sandwiching a thermoplastic or thermosetting resin material therebetween.

Claims

1. A heat transport device comprising:

a first base plate including a liquid suction and retention unit which retains a liquid-phase working fluid by capillary force;

a body with protrusions on a bottom face thereof;

a second base plate facing the first base plate, the second base plate including a face provided with a first concavity so as to define a vaporization chamber which vaporizes the liquid-phase working fluid retained in the liquid suction and retention unit to a gas-phase working fluid;

a second concavity provided on the face of the second base plate cooperating with the body so as to define a liquefaction chamber which liquefies the gas-phase working fluid vaporized at the vaporization chamber to the liquid-phase working fluid;

a first ditch provided on the face of the second base plate that defines a channel which transports the gas-phase working fluid from the vaporization chamber to the liquefaction chamber, a first end of the first ditch being in fluid communication within the second base plate with the vaporization chamber and a second end of the first ditch being in fluid communication within the second base plate with the liquefaction chamber;

a second ditch provided on the face of the second base plate that defines a further channel which transports the liquid-phase working fluid from the liquefaction chamber to the liquid suction and retention unit, a first end of the second ditch being in fluid communication within the second base plate with the liquefaction chamber and a second end of the second ditch being a closed end adjacent to the vaporization chamber such that the second end of the second ditch is not in fluid communication within the second base plate with the vaporization chamber;

a third concavity provided on the face of the second base plate and disposed between the first ditch and the second ditch, the third concavity cooperating with the first base plate to define a space for thermal insulation; and

a thermoplastic or thermosetting resin material bonding the first and second base plates,

wherein a surface of the first base plate is covered with a protective film, and

wherein the protective film includes silicon or titanium.

2. The heat transport device according to claim 1, further comprising a fourth concavity provided on the face of the second base plate which stores the liquid-phase working fluid that is supplied to the liquid suction and retention unit.

3. The heat transport device according to claim 2, further comprising a fifth concavity provided on the face of the second base plate which stores the liquid-phase working fluid that is supplied to the liquefaction chamber when the liquid-phase working fluid retained in the second concavity decreases lower than a predetermined level.

4. The heat transport device according to claim 1, wherein the first base plate is disposed above the second base plate.

5. The heat transport device according to claim 1, wherein the first base plate includes first and second openings, the liquid suction and retention unit is provided in the first opening and the body is provided in the second opening.

6. A method for manufacturing a heat transport device, comprising:

forming a first base plate including a liquid suction and retention unit configured to retain a liquid-phase working fluid by capillary force, and

a body provided with protrusions on a bottom face thereof;

forming a second base plate including a face provided with a first concavity so as to define a vaporization chamber configured to vaporize the liquid-phase working fluid retained in the liquid suction and retention unit to a gas-phase working fluid,

a second concavity cooperating with the body so as to define a liquefaction chamber configured to liquefy the gas-phase working fluid vaporized at the vaporization chamber to the liquid-phase working fluid,

a first ditch that defines a channel configured to transport the gas-phase working fluid from the vaporization chamber to the liquefaction chamber, a first end of the first ditch being in fluid communication within the second base plate with the vaporization chamber and a second end of the first ditch being in fluid communication within the second base plate with the liquefaction chamber,

a second ditch that defines a further channel configured to transport the liquid-phase working fluid from the liquefaction chamber to the liquid suction and retention unit, a first end of the second ditch being in fluid communication within the second base plate with the liquefaction chamber and a second end of the second ditch being a closed end adjacent to the vaporization chamber such that the second end of the second ditch is not in fluid communication within the second base plate with the vaporization chamber, and

a third concavity provided on the face of the second base plate and disposed between the first ditch and the second ditch, the third concavity cooperating with the first base plate to define a space for thermal insulation;

laminating the first base plate, a thermoplastic or thermosetting resin material, and the second base plate; and

bonding the first and the second base plates with the thermoplastic or thermosetting resin material by heating the composite of the first base plate, the thermoplastic or thermosetting resin material, and the second base plate under a pressurized condition;

oxidizing a surface of the first base plate;

coating the oxidized surface with a thin film of silicon or titanium; and

oxidizing the coated surface by plasma treatment.