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IC card

  • US 8,136,725 B2
  • Filed: 07/28/2009
  • Issued: 03/20/2012
  • Est. Priority Date: 08/29/2003
  • Status: Active Grant
First Claim
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1. A device comprising:

  • a plastic substrate;

    a first single crystal integrated circuit mounted over the plastic substrate;

    a second integrated circuit mounted over the plastic substrate; and

    a display device mounted over the plastic substrate;

    wherein the second integrated circuit and the display device each comprise a semiconductor element;

    wherein the semiconductor element comprises a semiconductor film including a channel formation region;

    wherein the display device is an active matrix type;

    wherein the first single crystal integrated circuit comprises an analog circuit and a radio frequency circuit, and the second integrated circuit comprises a digital circuit;

    wherein the semiconductor element is formed over an oxide film;

    wherein the oxide film is bonded to the plastic substrate with an adhesive agent;

    wherein the first single crystal integrated circuit is electrically connected to the second integrated circuit, andwherein a thickness of the second integrated circuit is 1 μ

    m or more and 5 μ

    m or less.

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