ID label, ID card, and ID tag

• US 8,136,735 B2
• Filed: 01/20/2005
• Issued: 03/20/2012
• Est. Priority Date: 01/23/2004
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Arai, Yasuyuki, Akiba, Mai, Tachimura, Yuko, Kanno, Yohei
• Primary Examiner(s): Le, Thien M.
• Assistant Examiner(s): TAYLOR, APRIL ALICIA
• Application Number:
  US10/586,156
• Publication Number:
  US 20080149731A1
• Time in Patent Office: 2,616 Days
• Field of Search: 235/439, 235/441, 235/451, 235/487, 235/488, 235/492, 438/149, 361/737, 340/572.1
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 27/1203 the substrate comprising an insulating body on a semiconductor body, e.g. SOI three-dimensional layout H01L27/0688
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/1266 the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
• CPC Class Codes: H01L 27/13 combined with thin-film or thick-film passive components
• CPC Class Codes: H01L 29/78603 characterised by the insulating substrate or support H01L29/78657 takes precedence
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01021 Scandium [Sc]
• CPC Class Codes: H01L 2924/01025 Manganese [Mn]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01077 Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]

Abstract

As a non-contact ID label, ID tag and the like being widespread, it is required to manufacture a considerable quantity of ID labels at quite a low cost. An ID label attached to a product is, for example, required to be manufactured at 1 to several yens each, or preferably less than one yen. Thus, such a structure and a process are demanded that an ID label can be manufactured in a large quantity at a low cost. A thin film integrated circuit device included in the ID label, the ID card, and the ID tag of the invention each includes a thin film active element such as a thin film transistor (TFT). Therefore, by peeling a substrate on which TFTs are formed for separating elements, the ID label and the like can be manufactured in a large quantity at a low cost.

Claims

1. An ID label comprising:

a label substratum

an antenna provided over the label substratum;

an integrated circuit device including a transistor, provided over and in contact with the label substratum;

an insulating layer provided over the antenna;

a wiring provided on the insulating layer; and

a separating sheet provided over the wiring;

wherein the wiring is electrically connected to the antenna through a contact hole formed in the insulating layer, and

wherein the antenna and the integrated circuit device are electrically connected through the wiring.

2. The ID label according to claim 1, wherein a protective layer comprising a single layer or stacked layers containing silicon oxide, silicon nitride or silicon oxynitride is formed on at least one of an upper surface and a lower surface of the integrated circuit device.

3. The ID label according to claim 1, wherein protective layers are formed on an upper surface and a lower surface of the integrated circuit device, and the integrated circuit device is placed at a position of (d/2)±

30 μ

m or less when a total thickness of the integrated circuit device and the protective layers is d.

4. The ID label according to claim 1, wherein a semiconductor film of the transistor included in the integrated circuit device contains hydrogen or halogen of 0.0005 to 5 atomic %.

5. The ID label according to claim 1, wherein a size of the integrated circuit device is 0.09 to 25 mm².

6. The ID label according to claim 1, wherein a thickness of the integrated circuit device is 0.1 to 3 μ

m.

7. The ID label according to claim 1, further comprising:

an adhesive layer between the wiring and the separating sheet.

8. The ID label according to claim 7, wherein the separating sheet is configured to be peeled from the adhesive layer.

15. The ID label according to claim 8, further comprising:

an adhesive layer between the label substratum and the separating sheet.

16. The ID label according to claim 15, wherein the separating sheet is configured to be peeled from the adhesive layer.

9. An ID label comprising:

an internal substratum having a first surface and a second surface,

an antenna provided over the first surface of the internal substratum;

an integrated circuit device including a transistor, provided over and in contact with the first surface of the internal substratum;

a wiring provided over the second surface of the internal substratum;

a label substratum provided over the integrated circuit device; and

a separating sheet over the wiring,

wherein the wiring is electrically connected to the antenna through a contact hole formed in the internal substratum, and

wherein the antenna and the integrated circuit device are electrically connected through the wiring.

10. The ID label according to claim 9, wherein a protective layer comprising a single layer or stacked layers containing silicon oxide, silicon nitride or silicon oxynitride is formed on at least one of an upper portion and a lower portion of the integrated circuit device.

11. The ID label according to claim 9, wherein protective layers are formed on an upper surface and a lower surface of the integrated circuit device, and the integrated circuit device is placed at a position of (d/2)±

30 μ

m or less when a total thickness of the integrated circuit device and the protective layers is d.

12. The ID label according to claim 9, wherein a semiconductor film of the thin film transistor included in the integrated circuit device contains hydrogen or halogen of 0.0005 to 5 atomic %.

13. The ID label according to claim 9, wherein a size of the integrated circuit device is 0.09 to 25 mm².

14. The ID label according to claim 9, wherein a thickness of the integrated circuit device is 0.1 to 3 μ

m.

17. An ID card comprising:

a card substratum over which an antenna is formed;

an insulating layer over the antenna;

a wiring formed on the insulating layer;

an integrated circuit device including a transistor, provided over and in contact with the card substratum; and

a cover for covering at least a side of the card substratum where the antenna and the integrated circuit device are formed,

wherein the wiring is electrically connected to the antenna through a contact hole formed in the insulating layer, and

wherein the antenna and the integrated circuit device are electrically connected through the wiring.

18. The ID card according to claim 17, wherein the cover comprises resin and is formed by a laminating method.

19. The ID card according to claim 17, wherein a protective layer comprising a single layer or stacked layers containing silicon oxide, silicon nitride or silicon oxynitride is formed on at least one of an upper surface and a lower surface of the integrated circuit device.

20. An ID card comprising:

an internal substratum having a first surface and a second surface opposing to the first surface;

an antenna formed over the first surface of the internal substratum;

an integrated circuit device including a transistor, over the first surface of the internal substratum;

a wiring formed on the second surface of the internal substratum; and

a cover for covering around the internal substratum,

wherein the wiring is electrically connected to the antenna through a contact hole formed in the internal substratum, and

wherein the antenna and the integrated circuit device are electrically connected through the wiring.

21. The ID card according to claim 20, wherein the cover comprises resin and is formed by a laminating method.

22. The ID card according to claim 20, wherein a protective layer comprising a single layer or stacked layers containing silicon oxide, silicon nitride or silicon oxynitride is formed on at least one of an upper surface and a lower surface of the integrated circuit device.

23. An ID tag comprising:

a integrated circuit device including a transistor provided in contact with a substratum on which an antenna is formed;

an insulating layer over the antenna;

a wiring formed over the insulating layer; and

a cover for covering at least a side of the substratum the antenna and the integrated circuit device are formed,

wherein the wiring is electrically connected to the antenna through a contact hole formed in the insulating layer, and

wherein the antenna and the integrated circuit device are electrically connected through the wiring.

24. The ID tag according to claim 23, wherein the cover comprises resin and is formed by a laminating method.

25. The ID tag according to claim 23, wherein a protective layer comprising a single layer of stacked layers containing silicon oxide, silicon nitride of silicon oxynitride is formed on at least one of an upper surface and a lower surface of the integrated circuit device.

26. An ID tag comprising:

an internal substratum having a first surface and a second surface opposing to the first surface;

an antenna formed over the first surface of the internal substratum;

an integrated circuit device including a transistor over the first surface of the internal substratum;

a wiring formed on the second surface of the internal substratum; and

a cover for covering around the internal substratum,

wherein the wiring is electrically connected to the antenna through a contact hole formed in the internal substratum, and

wherein the antenna and the integrated circuit device are electrically connected through the wiring.

27. The ID tag according to claim 26, wherein the cover comprises resin and is formed by a laminating method.

28. The ID tag according to claim 26, wherein a protective layer comprising a single layer of stacked layers containing silicon oxide, silicon nitride of silicon oxynitride is formed on at least one of an upper surface and a lower surface of the thin film integrated circuit device.

29. An object comprising:

an integrated circuit device including a transistor provided in contact with a substratum on which an antenna is formed;

an insulating layer over the antenna;

a wiring formed over the insulating layer; and

a cover for covering at least a side of the substratum where the antenna and the integrated circuit device are formed,

wherein the wiring is electrically connected to the antenna through a contact hole formed in the insulating layer, and

wherein the antenna and the integrated circuit device are electrically connected through the wiring.

30. The object according to claim 29, wherein a protective layer comprising a single layer or stacked layers containing silicon oxide, silicon nitride or silicon oxynitride is formed on at least one of an upper surface and a lower surface of the integrated circuit device.

31. An object comprising:

an internal substratum having a first surface and a second surface opposing to the first surface;

an antenna formed over the first surface of the internal substratum;

an integrated circuit device including a transistor over the first surface of the internal substratum;

a wiring formed on the second surface of the internal substratum; and

a cover for covering around the internal substratum,

wherein the wiring is electrically connected to the antenna through a contact hole formed in the internal substratum, and

wherein the antenna and the integrated circuit device are electrically connected through the wiring.

32. The object according to claim 31, wherein a protective layer comprising a single layer or stacked layers containing silicon oxide, silicon nitride or silicon oxynitride is formed on at least one of an upper surface and a lower surface of the integrated circuit device.

33. -An ID label comprising:

a label substratum having a first surface and a second surface opposing to the first surface;

an antenna formed over the first surface of the label substratum;

an integrated circuit device including a transistor, over the first surface of the label substratum;

a wiring formed on the second surface of the label substratum;

a separating sheet provided over the first surface of the label substratum with an adhesive layer, antenna, and the integrated circuit device interposed therebetween,

wherein the wiring is electrically connected to the antenna through a contact hole formed in the label substratum, and

wherein the antenna and the integrated circuit device are electrically connected through the wiring.

34. An ID label comprising:

a label substratum;

an antenna formed over the label substratum;

an insulating layer over the antenna;

a wiring formed on the insulating layer;

an integrated circuit device including a transistor, over the label substratum;

a separating sheet provided over the label substratum with an adhesive layer, the antenna, and the insulating layer, and the integrated circuit device interposed therebetween,

wherein the wiring is electrically connected to the antenna through a contact hole formed in the insulating layer, and

wherein the antenna and the integrated circuit device are electrically connected through the wiring.