Microfluidic module including an adhesiveless self-bonding rebondable polyimide

• US 8,137,641 B2
• Filed: 02/16/2011
• Issued: 03/20/2012
• Est. Priority Date: 09/17/2007
• Status: Active Grant

• Current Assignee: YSI Incorporated (Xylem, Inc.)
• Original Assignee: YSI Incorporated (Xylem, Inc.)
• Inventors: Moles, Donald R.
• Primary Examiner(s): Bullock, In Suk
• Assistant Examiner(s): Kingan, Timothy G
• Application Number:
  US13/028,550
• Publication Number:
  US 20110132870A1
• Time in Patent Office: 398 Days
• Field of Search: None
• US Class Current: 422/504
• CPC Class Codes: B01L 2200/0689 Sealing
• CPC Class Codes: B01L 2200/12 Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/0627 Sensor or part of a sensor is integrated
• CPC Class Codes: B01L 2300/0816 Cards, e.g. flat sample carriers usually with flow in two horizontal directions
• CPC Class Codes: B01L 2300/0887 Laminated structure
• CPC Class Codes: B01L 2300/12 Specific details about materials
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

A method of making a microfluidic module is disclosed that includes forming a fluid flow channel in a self-bonding rebondable polyimide film to provide a channel sheet, the self-bonding rebondable polyimide film having a first mask layer self-bonded thereto; removing the first mask layer from the channel sheet after forming the fluid flow channel; and self-bonding the surface of the channel sheet exposed by removal of the first mask layer to a cover sheet.

Claims

1. A method of making a microfluidic module comprising:

providing a self-bonding polyimide film having a first major surface and a second major surface;

bonding, without adhesive, the first major surface of the self-bonding polyimide film to a first mask layer;

forming a fluid flow channel in the self-bonding polyimide film,

removing the first mask layer from the first major surface of the self-bonding polyimide film after forming the fluid flow channel; and

re-bonding, without adhesive, the first major surface of the self-bonding polyimide film, exposed by removal of the first mask layer, to a first cover sheet.

2. The method of claim 1 wherein the forming of the fluid flow channel includes etching the first mask layer with a fluidic pattern and etching the fluid flow channel into the self-bonding polyimide film through the etched first mask layer.

3. The method of claim 1 wherein the self-bonding polyimide film is a composite film that includes a thermoplastic polyimide in at least a top surface and a bottom surface of the film.

4. The method of claim 1 wherein at least one of the bonding step and the re-bonding step includes application of heat and/or pressure.

5. The method of claim 4 wherein the bonding step or the re-bonding step includes heating at about 275°

C. to about 325°

C. for about 5 minutes to about 3 hours.

6. The method of claim 5 wherein the bonding step or re-bonding step includes applying pressure of about 300 to about 400 psi.

7. The method of claim 1 wherein the first cover sheet is plastic, polyimide, self-bonding polyimide, or metal.

8. The method of claim 1 wherein the first mask layer includes metal, silicon, or glass.

9. The method of claim 1 wherein the self-bonding polyimide film includes a second mask layer bonded thereto, without adhesive, on the second major surface opposite the first mask layer.

10. The method of claim 9 wherein at least one of the first and second mask layers is metal.

11. The method of claim 10 wherein the first mask layer includes copper.

12. The method of claim 11 wherein the second mask layer includes stainless steel.

13. The method of claim 9 further comprising removing the second mask layer, after the step of re-bonding the first major surface of the self-bonding polyimide film to the first cover sheet.

14. The method of claim 13 further comprising re-bonding the second major surface of the self-bonding polyimide film, exposed by removal of the second mask layer, to a second cover sheet.

15. The method of claim 1 wherein the removing of the first mask layer includes exposing the first mask layer to a chemical solution.

16. The method of claim 9 wherein the removing of the first mask layer includes exposing the first mask layer to a chemical solution that removes the first mask layer without removing the second mask layer.

17. The method of claim 1 further comprising simultaneously bonding, without adhesive, the first mask layer to the first major surface and a second mask layer to the second major surface of self-bonding polyimide film.