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Forming an oxide MEMS beam

  • US 8,138,008 B1
  • Filed: 11/29/2010
  • Issued: 03/20/2012
  • Est. Priority Date: 11/29/2010
  • Status: Active Grant
First Claim
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1. A method of forming a beam within a sealed cavity, the method comprising:

  • depositing a lower insulator layer comprising one or more layers;

    depositing an upper insulator layer over the first insulator layer, the upper insulator layer comprising one or more layers, wherein a composite stress of the upper insulator layer is different than a composite stress of the lower insulator layer;

    forming a first conductor layer below the lower insulator layer and a second conductor layer above the upper insulator layer, wherein each conductor layer comprises one or more metal layers; and

    forming a stabilizing insulator layer between at least one of;

    the upper insulator layer and the second conductor or the first conductor and the lower insulator layer, wherein the at least one of the upper insulator layer or the lower insulator layer includes an unstable stress when exposed to ambient.

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