Large area integration of quartz resonators with electronics
First Claim
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1. A large scale integration of quartz-based devices with an electronics host wafer, wherein the large scale integration is formed by a method comprising the steps of:
- selecting a plurality of quartz-based devices according to their possession of desired characteristics, wherein each selected quartz-based device is attached to an individual handle wafer;
attaching the quartz-based devices to the electronics host wafer to form an array of quartz-based devices on the electronics host wafer;
bonding the quartz-based devices to the electronics host wafer; and
removing the individual handle wafers from the quartz-based devices.
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Abstract
Methods for integrating quartz-based resonators with electronics on a large area wafer through direct pick-and-place and flip-chip bonding or wafer-to-wafer bonding using handle wafers are described. The resulting combination of quartz-based resonators and large area electronics wafer solves the problem of the quartz-electronics substrate diameter mismatch and enables the integration of arrays of quartz devices of different frequencies with the same electronics.
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18 Claims
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1. A large scale integration of quartz-based devices with an electronics host wafer, wherein the large scale integration is formed by a method comprising the steps of:
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selecting a plurality of quartz-based devices according to their possession of desired characteristics, wherein each selected quartz-based device is attached to an individual handle wafer; attaching the quartz-based devices to the electronics host wafer to form an array of quartz-based devices on the electronics host wafer; bonding the quartz-based devices to the electronics host wafer; and removing the individual handle wafers from the quartz-based devices. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A large scale integration of quartz-based resonators with an electronics host wafer, wherein the large scale integration is formed by a method comprising the steps of:
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providing a plurality of quartz-based resonators possessing desired resonant frequencies, each of the resonators having at least one electrode formed on a first surface of the quartz-based resonator and being attached to an individual handle wafer; placing the plurality of quartz-based resonators in contact with the electronics host wafer to form an array of quartz-based resonators on a surface of the electronics host wafer wherein the electrode of each quartz-based resonator is in electrical communication with an electrode disposed on the surface of the electronics host wafer; bonding the plurality of quartz-based resonators to the electronics host wafer; and removing the individual handle wafers from the plurality of quartz-based resonators. - View Dependent Claims (17, 18)
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Specification