×

Semiconductor device and method of fabricating the same

  • US 8,138,589 B2
  • Filed: 09/28/2010
  • Issued: 03/20/2012
  • Est. Priority Date: 04/27/2007
  • Status: Expired due to Fees
First Claim
Patent Images

1. A semiconductor device comprising:

  • a first semiconductor element;

    a first electrode electrically connected to the first semiconductor element;

    a second semiconductor element operationally connected to the first semiconductor element;

    a second electrode electrically connected to the second semiconductor element;

    an interposer attached to the first electrode terminal and the second electrode terminal with an adhesive layer including conductive particles;

    a first connection terminal disposed on the interposer so as to penetrate through the interposer and electrically contact the first electrode terminal through at least one of the conductive particles; and

    a second connection terminal disposed on the interposer so as to penetrate through the interposer and electrically contact the second electrode terminal through at least one of the conductive particles.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×