Semiconductor device having an antenna with anisotropic conductive adhesive
First Claim
1. A semiconductor device comprising:
- a semiconductor integrated circuit;
a connection terminal electrically connected to the semiconductor integrated circuit;
a conductive polymer substrate provided with an antenna that comprises a conductive layer; and
an anisotropic conductive adhesive including a conductive polymer and a conductive particle for electrically connecting the connection terminal and the antenna, wherein a volume resistivity of the conductive polymer is greater than or equal to 103 Ω
·
cm and less than or equal to 106 Ω
·
cm.
1 Assignment
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Accused Products
Abstract
It is an object to provide a semiconductor device capable of transmitting and receiving data with a reader/writer and reducing breakdown or interference due to static electricity. A semiconductor device includes a semiconductor integrated circuit, a conductive layer serving as an antenna that is connected to the semiconductor integrated circuit, and a substrate interposing the semiconductor integrated circuit and the conductive layer, where at least one of a layer forming the semiconductor integrated circuit, a layer covering the semiconductor integrated circuit, and the substrate is formed from a conductive polymer. In accordance with the above structure, wireless communication with a reader/writer is possible, and breakdown or malfunction in the semiconductor integrated circuit due to static electricity is reduced.
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Citations
12 Claims
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1. A semiconductor device comprising:
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a semiconductor integrated circuit; a connection terminal electrically connected to the semiconductor integrated circuit; a conductive polymer substrate provided with an antenna that comprises a conductive layer; and an anisotropic conductive adhesive including a conductive polymer and a conductive particle for electrically connecting the connection terminal and the antenna, wherein a volume resistivity of the conductive polymer is greater than or equal to 103 Ω
·
cm and less than or equal to 106 Ω
·
cm. - View Dependent Claims (2, 3)
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4. A semiconductor device comprising:
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a semiconductor integrated circuit; a connection terminal electrically connected to the semiconductor integrated circuit; a conductive polymer substrate provided with an antenna that comprises a conductive layer over the semiconductor integrated circuit; and an anisotropic conductive adhesive including a conductive polymer and a conductive particle for electrically connecting the connection terminal and the antenna, wherein a volume resistivity of the conductive polymer is greater than or equal to 103 Ω
·
cm and less than or equal to 106 Ω
·
cm. - View Dependent Claims (5, 6)
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7. A semiconductor device comprising:
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a semiconductor integrated circuit; a connection terminal electrically connected to the semiconductor integrated circuit; a conductive polymer substrate provided with an antenna that comprises a conductive layer; and an anisotropic conductive adhesive including a conductive polymer and a conductive particle for electrically connecting the connection terminal and the antenna, wherein a volume resistivity of each of the conductive polymer substrate and the conductive polymer is greater than or equal to 103 Ω
·
cm and less than or equal to 106 Ω
·
cm. - View Dependent Claims (8, 9)
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10. A semiconductor device comprising:
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a semiconductor integrated circuit; a connection terminal electrically connected to the semiconductor integrated circuit; a conductive polymer substrate provided with an antenna that comprises a conductive layer over the semiconductor integrated circuit; and an anisotropic conductive adhesive including a conductive polymer and a conductive particle for electrically connecting the connection terminal and the antenna, wherein a volume resistivity of each of the conductive polymer substrate and the conductive polymer is greater than or equal to 103 Ω
·
cm and less than or equal to 106 Ω
·
cm. - View Dependent Claims (11, 12)
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Specification