Light emitting device and method of manufacturing the same

• US 8,138,663 B2
• Filed: 09/23/2010
• Issued: 03/20/2012
• Est. Priority Date: 09/30/2009
• Status: Expired due to Fees

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Hamaguchi, Yuichi, Banno, Noriyuki
• Primary Examiner(s): Williams, Joseph L
• Application Number:
  US12/888,653
• Publication Number:
  US 20110006664A1
• Time in Patent Office: 544 Days
• Field of Search: 313/358, 313/498, 257/10, 257/98, 372/50.121
• US Class Current: 313/358
• CPC Class Codes: G11B 2007/0006 adapted for scanning different types of carrier, e.g. CD & DVD
• CPC Class Codes: G11B 7/1275 Two or more lasers having different wavelengths
• CPC Class Codes: H01S 5/02 Structural details or components not essential to laser action
• CPC Class Codes: H01S 5/4025 Array arrangements, e.g. constituted by discrete laser diodes or laser bar H01S5/42 takes precedence
• CPC Class Codes: H01S 5/4087 emitting more than one wavelength

Abstract

The present invention provides a light emitting device solving weakness caused by bonding between first and second light emitting elements and a method of manufacturing the same. A chip-shaped first light emitting element and a second light emitting element overlapped each other are disposed on a supporting base. Four island-shaped projections are provided on the top face of the supporting base, and support the second light emitting element. The projections are formed by wet-etching or dry-etching the supporting base, and a pad electrode is provided on the top face of the projection. The pad electrode is electrically connected to the second light emitting element and is also electrically connected to a wire.

Claims

1. A light emitting device comprising:

a supporting base having a projection on its top face;

a first light emitting element disposed in a region in which the projection is not formed in the top face;

a second light emitting element disposed on the first light emitting element and the projection;

one or plural pad electrodes each having a first connection face electrically connected to the second light emitting element and a second connection face electrically connected to an external conductive member and formed on the top face of the projection; and

an extraction electrode formed in a region in which the projection is not formed in the top face and electrically connected to the first light emitting element.

2. The light emitting device according to claim 1, wherein the projection is made of the same material as that of a portion other than the projection in the supporting base.

3. The light emitting device according to claim 2, wherein an insulating layer is provided on the top face of the projection, and

the supporting base is made of a conductive material.

4. The light emitting device according to claim 3, wherein the conductive material is highly-doped silicon.

5. The light emitting device according to claim 2, wherein the supporting base is made of an insulating material.

6. The light emitting device according to claim 5, wherein the insulating material is non-doped silicon or lightly-doped silicon.

7. The light emitting device according to claim 1, wherein the projection is formed by wet-etching or dry-etching the supporting base.

8. The light emitting device according to claim 1, wherein the projection is made of a material different from that of a portion other than the projection in the supporting base.

9. The light emitting device according to claim 8, wherein the projection is made of an insulating material.

10. The light emitting device according to claim 9, wherein the projection is a ceramic block.

11. The light emitting device according to claim 8, wherein an insulating layer is provided on the top face of the projection, and

the projection is made of a conductive material.

12. The light emitting device according to claim 11, wherein the projection is a semiconductor block or a metal block.

13. The light emitting device according to claim 1, wherein the top face of the projection is a flat face.

14. The light emitting device according to claim 1, wherein the second connection face is formed in a position higher than the first connection face.

15. A light emitting device comprising:

a conductive supporting base having a projection on its top face;

a first light emitting element disposed in a region in which the projection is not formed in the top face;

a second light emitting element disposed on the first light emitting element and the projection;

one or plural pad electrodes each having a first connection face electrically connected to the second light emitting element and a second connection face electrically connected to an external conductive member and formed on the top face of the projection; and

an extraction electrode formed on a rear face of the supporting base and electrically connected to the supporting base.

16. A method of manufacturing a light emitting device comprising the steps of:

preparing a supporting base having a projection on its top face, a first light emitting element, and a second light emitting element whose horizontal width is larger than that of the first light emitting element;

forming one or plural pad electrodes each having, on the top face of the projection, a first connection face electrically connected to the second light emitting element and a second connection face electrically connected to an external conductive member;

forming a mount electrode for mounting the first light emitting element and an extraction electrode electrically connected to the mount electrode in a region in which the projection is not formed in the top face; and

disposing the first light emitting element on the mount electrode and disposing the second light emitting element on the first light emitting element and the first connection face.

17. The method of manufacturing a light emitting device according to claim 16, wherein in the disposing step, the first and second light emitting elements are joined to each other and integrated, and the integrated elements are disposed.

18. The method of manufacturing a light emitting device according to claim 16, wherein in the disposing step, the first light emitting element is disposed on the mount electrode and the second light emitting element is then disposed on the first light emitting element and the first connection face.

19. A method of manufacturing a light emitting device comprising the steps of:

preparing a conductive supporting base having a projection on its top face, a first light emitting element, and a second light emitting element whose horizontal width is larger than that of the first light emitting element;

forming one or plural pad electrodes each having, on the top face of the projection, a first connection face electrically connected to the second light emitting element and a second connection face electrically connected to an external conductive member;

forming a mount electrode for mounting the first light emitting element in a region in which the projection is not formed in the top face;

forming, on a rear face of the supporting base, an extraction electrode electrically connected to the supporting base; and

disposing the first light emitting element on the mount electrode and disposing the second light emitting element on the first light emitting element and the first connection face.