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Substrate distortion measurement

  • US 8,139,218 B2
  • Filed: 07/06/2005
  • Issued: 03/20/2012
  • Est. Priority Date: 07/06/2005
  • Status: Active Grant
First Claim
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1. A method comprising:

  • (i) measuring the sizes and locations of marks on a substrate;

    (ii) determining distortions in the substrate by comparing the measured sizes and locations with previously measured sizes and locations of the marks; and

    (iii) exposing the substrate to patterned radiation,wherein a first side of the substrate is exposed to the patterned radiation and wherein the sizes and locations of the marks are measured from a second side of the substrate that is opposite to said first side.

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