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Condition monitoring device and monitor main unit for condition monitoring device

  • US 8,142,357 B2
  • Filed: 11/08/2007
  • Issued: 03/27/2012
  • Est. Priority Date: 11/10/2006
  • Status: Expired due to Fees
First Claim
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1. A condition monitoring device for monitoring conditions related to a user, the condition monitoring device comprising:

  • a first sensor unit, carried by the user, configured to detect a monitored condition;

    a monitor main unit including a connection structure detachably attachable to the first sensor unit, the first sensor unit including a first connector mateable with the connection structure of the monitor main unit and a second connector detachably attachable to a second sensor unit carriable by the user, wherein;

    data associated with the monitored condition detected by the first sensor unit is provided to the monitor main unit via the first connector and the connection structure and processed by the monitor main unit; and

    data associated with a monitored condition detected by the second sensor unit is provided to the monitor main unit via the second connector, the first sensor unit, the first connector, and the connection structure and processed by the monitor main unit; and

    a supporting member configured to support the monitor main unit and a plurality of sensor units including the first and second sensor units to put the monitor main unit and the plurality of the sensor units on the user, the supporting member having attachment through holes, wherein the sensor units and the monitor main unit each have a pin configured to be press-fitted to one of the attachment through holes of the supporting member, each pin having a distal end face configured to come into close contact with the user when the user wears the supporting member supporting the sensor units and the monitor main unit, and wherein the pins of the first sensor unit and the monitor main unit are separated from one another by a fixed distance that corresponds to a distance between adjacent two attachment through holes of the supporting member in a state in which the first connector that is integrally formed on a side surface of the first sensor unit is directly mated with the connection structure that is integrally formed on a side surface of the monitor main unit.

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