Methods for multi-stage molding of integrated circuit package
First Claim
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1. A method, comprising:
- attaching at least one die to a leadframe having lead fingers;
attaching wirebonds to make connections between the at least one die and the leadfingers;
injecting a first mold material at a first pressure for preventing wire sway of the wirebonds, encapsulating the wirebonds, and covering at least a portion of the at least one die and the leadfingers to form an assembly, wherein the first mold material is only on a die-side of the leadframe and overmolds all wirebonds connected to the at least one die;
waiting for the first mold material to at least partially cure;
securing a magnet to the assembly;
injecting a second mold material at a second pressure greater than the first pressure for overmolding the at least one die, the first mold material, and the magnet; and
selecting a material for the first mold material based at least in part upon similarity of coefficient of expansion with the magnet.
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Abstract
Methods for providing an integrated circuit using a multi-stage molding process to protect wirebonds. In one embodiment, a method includes attaching a die to a leadframe having a lead finger, attaching a wirebond between the die and the leadfinger, applying a first mold material over at least a portion of the wirebond and the die and the leadfinger to form an assembly, waiting for the first mold material to at least partially cure, and applying a second mold material over the assembly.
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Citations
10 Claims
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1. A method, comprising:
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attaching at least one die to a leadframe having lead fingers; attaching wirebonds to make connections between the at least one die and the leadfingers; injecting a first mold material at a first pressure for preventing wire sway of the wirebonds, encapsulating the wirebonds, and covering at least a portion of the at least one die and the leadfingers to form an assembly, wherein the first mold material is only on a die-side of the leadframe and overmolds all wirebonds connected to the at least one die; waiting for the first mold material to at least partially cure; securing a magnet to the assembly; injecting a second mold material at a second pressure greater than the first pressure for overmolding the at least one die, the first mold material, and the magnet; and selecting a material for the first mold material based at least in part upon similarity of coefficient of expansion with the magnet. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method, comprising:
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attaching at least one die to a leadframe having lead fingers; attaching wirebonds to make connections between the at least one die and the leadfingers; injecting a first mold material at a first pressure for preventing wire sway of the wirebonds, encapsulating the wirebonds, and covering at least a portion of the at least one die and the leadfingers to form an assembly, wherein the first mold material is only on a die-side of the leadframe and overmolds all wirebonds connected to the at least one die; waiting for the first mold material to at least partially cure; securing a magnet to the assembly; injecting a second mold material at a second pressure greater than the first pressure for overmolding the at least one die, the first mold material, and the magnet; and selecting the second pressure to eliminate voids in or around a magnet forming a part of a magnetic sensor.
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8. A method, comprising:
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attaching at least one die to a leadframe having lead fingers; attaching wirebonds to make connections between the at least one die and the leadfingers; injecting a first mold material at a first pressure for preventing wire sway of the wirebonds, encapsulating the wirebonds, and covering at least a portion of the at least one die and the leadfingers to form an assembly, wherein the first mold material is only on a die-side of the leadframe and overmolds all wirebonds connected to the at least one die; waiting for the first mold material to at least partially cure; securing a magnet to the assembly; injecting a second mold material at a second pressure greater than the first pressure for overmolding the at least one die, the first mold material, and the magnet, wherein the die includes a magnetic field sensor. - View Dependent Claims (9, 10)
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Specification