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Method for forming resist pattern, method for producing circuit board, and circuit board

  • US 8,143,533 B2
  • Filed: 05/17/2006
  • Issued: 03/27/2012
  • Est. Priority Date: 05/17/2006
  • Status: Expired due to Fees
First Claim
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1. A method for producing a circuit board, comprising the steps of:

  • (a) preparing an insulating substrate having a through-hole(s), which has a first conductive layer on a first surface, on a second surface opposite to the first surface and on an inner wall of the through-holes(s);

    (b) covering the first conductive layer and an opening of the through-hole(s) on the first surface with a photocrosslinkable resin layer and a mask layer by forming the photocrosslinkable resin layer and the mask layer on the first surface;

    (c) uncovering the first conductive layer on the periphery of the through-hole(s) on the first surface by supplying a photocrosslinkable resin layer removing solution from the second surface and removing the photocrosslinkable resin layer on the through-hole(s) and on a periphery of the through-hole(s) on the first surface;

    (d) subjecting the photocrosslinkable resin layer on the first surface to pattern exposure;

    (e) covering the first conductive layer and an opening of the through-hole(s) on the second surface with a photocrosslinkable resin layer and a mask layer by forming the photocrosslinkable resin layer and the mask layer on the second surface;

    (f) removing the mask layer on the first surface;

    (g) uncovering the first conductive layer on the first surface and the first conductive layer on a periphery of the through-hole(s) on the second surface by supplying a photocrosslinkable resin layer removing solution from the first surface and removing an uncured photocrosslinkable resin layer on the first surface and the photocrosslinkable resin layer on the through-hole(s) and on the periphery of the through-hole(s) on the second surface;

    (h) subjecting the photocrosslinkable resin layer on the second surface to pattern exposure;

    (i) removing the mask layer on the second surface;

    (j) uncovering the first conductive layer on the second surface by supplying a photocrosslinkable resin layer removing solution from the second surface and removing an uncured photocrosslinkable resin layer on the second surface;

    (k) forming a second conductive layer on the first conductive layer uncovered on the inner wall of the through-hole(s) and the periphery of the through-hole(s) and on the first surface and the second surface by electrolytic plating;

    (l) uncovering the first conductive layer on the first surface and the second surface by removing the cured photocrosslinkable resin layers on the first surface and the second surface; and

    (m) removing the uncovered first conductive layer by flash etching.

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