Package-on-package (POP) optical proximity sensor

• US 8,143,608 B2
• Filed: 09/10/2009
• Issued: 03/27/2012
• Est. Priority Date: 09/10/2009
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Avago Technologies ECBU IP Singapore Pte Limited (Broadcom, Inc.)
• Inventors: Ong, Chi Boon, Yao, Yufeng
• Primary Examiner(s): PYO, KEVIN K
• Application Number:
  US12/557,516
• Publication Number:
  US 20110057129A1
• Time in Patent Office: 929 Days
• Field of Search: 250/551, 250/239, 250/214.AL, 250/221, 250/338.1, 257/81, 257433-435, 257/678, 257/686, 257/687, 257/E33.058, 438/25, 438/26, 356/220
• US Class Current: 250/551
• CPC Class Codes: G01S 17/04 Systems determining the presence of a target
• CPC Class Codes: G01S 17/48 Active triangulation systems, i.e. using the transmission and reflection of electromagnetic waves other than radio waves
• CPC Class Codes: G01S 7/4813 Housing arrangements
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/173 formed in, or on, a common substrate
• CPC Class Codes: H03K 17/941 using an optical detector H03K17/968 takes precedence
• CPC Class Codes: H03K 2217/94108 making use of reflection

Abstract

Various embodiments of a package-on-package optical sensor comprising three distinct different packages are disclosed. The three different packages are combined to form the optical proximity sensor, where the first package is a light emitter package, the second package is a light detector package, and the third package is an integrated circuit package. First and second infrared light pass components are molded or casted atop the light emitter package and the light detector package after they have been mounted atop the integrated circuit package. An infrared light cut component is then molded or casted between and over portions of the light emitter package and the light detector package.

Claims

1. An optical proximity sensor, comprising:

an infrared light emitter mounted atop a first substrate;

a light detector mounted atop a second substrate, and

an integrated circuit mounted atop a third substrate and encapsulated by an overmolding material, the integrated circuit comprising light emitter driving and light detecting circuits, the third substrate further comprising at least first and second sets of wire bond pads electrically connected to the integrated circuit and not covered by the overmolding material;

wherein the first and second substrates are mounted atop the overmolding compound, the light emitter is electrically connected to the light emitter driving circuit through the first set of wire bond pads, the light detector is electrically connected to the light detecting circuit through the second set of wire bond pads, a first molded infrared light pass component is disposed over and covers the light emitter, a second molded infrared light pass component is disposed over and covers the light detector, and a molded infrared light cut component is disposed between and over portions of the third substrate and the first and second infrared light pass components.

2. The optical proximity sensor of claim 1, wherein at least a first portion of light emitted by the light emitter passes through the first component, and at least a second portion of the first portion of light reflected from an object of interest in proximity to the sensor passes through the second component for detection by the light detector, and the infrared light cut component substantially attenuates or blocks the transmission of undesired direct, scattered or reflected light between the light emitter and the light detector and thereby minimizes optical crosstalk and interference between the light emitter and the light detector.

3. The optical proximity sensor of claim 1, wherein at least one of the first and second infrared light pass components comprises an optically transmissive epoxy, polymer or plastic.

4. The optical proximity sensor of claim 1, wherein the infrared light cut component comprises a substantially optically non-transmissive moldable material, epoxy, polymer or plastic.

5. The optical proximity sensor of claim 1, wherein the infrared light cut component further comprises an infrared cut or blocking additive.

6. The optical proximity sensor of claim 1, wherein at least one of the first, second and third substrates is a printed circuit board (“

PCB”

).

7. The optical proximity sensor of claim 1, wherein at least one of the light emitter and the light detector is a semiconductor die.

8. The optical proximity sensor of claim 1, wherein the integrated circuit is an application specific integrated circuit (“

ASIC”

).

9. The optical proximity sensor of claim 1, further comprising an ambient light sensor.

10. The optical proximity sensor of claim 9, further wherein the ambient light sensor is mounted atop the second substrate.

11. The optical proximity sensor of claim 1, wherein the optical proximity sensor is incorporated into a portable electronic device.

12. The optical proximity sensor of claim 11, wherein the portable electronic device is a mobile telephone, a personal data assistant (PDA), a laptop computer, a notebook computer, or a computer.

13. The optical proximity sensor of claim 1, wherein the light emitter is an LED.

14. The optical proximity sensor of claim 1, wherein the light detector is a positive-intrinsic-negative (“

PIN”

) diode.

15. The optical proximity sensor of claim 1, wherein a molded optically transmissive lens is formed over at least one of the light emitter or the light detector.

16. A method of making an optical proximity sensor, comprising:

mounting an infrared light emitter atop a first substrate;

mounting a light detector atop a second substrate;

mounting an integrated circuit atop a third substrate comprising at least first and second sets of wire bond pads electrically connected to the integrated circuit, the integrated circuit comprising light emitter driving and light detecting circuits;

at least partially encapsulating the integrated circuit with an overmolding material such that the wire bond pads are covered by the overmolding material;

mounting the first and second substrates atop the overmolding compound;

electrically connecting the light emitter to the light emitter driving circuit through the first set of wire bond pads;

electrically connecting the light detector to the light detecting circuit through the second set of wire bond pads;

molding or casting a first infrared light pass component the light emitter;

molding or casting a second infrared light pass component over the light detector, and

molding or casting an infrared light cut component between and over portions of the third substrate and the first and second infrared light pass components.

17. The method of claim 16, further comprising configuring light detector and the light emitter with respect to one another such that at least a first portion of light emitted by the light emitter passes through the first component and at least a second portion of the first portion of light reflected from an object of interest in proximity to the sensor passes through the second component for detection by the light detector.

18. The method of claim 16, further comprising configuring the infrared light cut component to substantially attenuate or block the transmission of undesired direct, scattered or reflected light between the light emitter and the light detector and thereby minimizes optical crosstalk and interference between the light emitter and the light detector.

19. The method of claim 16, wherein optically transmissive lenses are formed over the light emitter and the light detector when the first and second optically transmissive infrared light pass components are molded or casted.

20. The method of claim 16, wherein the light emitter or the light detector is die-attached to the first or second substrate, respectively.

21. The method of claim 16, wherein the light emitter or the light detector is wire-bonded to the first or second substrate, respectively.

22. The method of claim 16, wherein the first and second optically transmissive infrared light pass components are transfer-molded.